EVG 510

EVG 510
Equipment Details
Technology	Wafer bonding
Materials Restriction	Metals
Material Processed	Si, Glass
Sample Size	pieces, 100 mm, 150 mm
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Processes
Maintenance	Maintenance

The EVG 510 is a wafer bonder capable of bonding pieces up to 150 mm wafers. It is primarily used for polymer bonding and wafer mounting with WaferBOND, but can also be used for other other types of bonding. Generally the EVG 520IS should be used for non-polymer bonding since the polymer bonding in EVG510 can leave contaminants that may interfere with non-polymer bonding. Also the CL200 Megasonic Cleaner can be used before bonding to reduce particulate.

Announcements

Please see the latest monthly update: Announcements

Starting 11/17/25 You will need check out the bond chuck. To do this, open a help desk ticket and request the required bond chuck. You will need to have a scheduled reservation on either the EVG 510 or EVG 520IS to check out a bond chuck. Your reservation parameters will have to match the allowable processes for the bond chuck and pressure plate combinations.

Bonder plate schedule

• Default: what is currently in the tool. If that is required in the EVG 520IS then the Old 4" Ti plate will be installed.

Use the drop down menus during reservation to indicate the tooling you will need. If the pressure plate it is different than what is on the calendar, open a help desk ticket to request a change. Include the type of bonding, sample size, pressures used, and when you will need this. Priority will be given to tickets with a corresponding tool reservation unless there are already reservations using the scheduled plate. You need to allow 2 business days before the next schedule change day. If there are existing reservations to use the scheduled plate, those will take precedence. Conflicting change request will be prioritized by when the request arrived and have corresponding tool reservations. If you don't have a tool reservation the request with a reservation will receive higher priority.

Only staff may change pressure plates.

Capabilities

• Bonding
  • Polymer
  • Eutectic
• Wafer mounting via WaferBOND

System Overview

Hardware Details

• Force
  • 0.1 to 10 kN
  • Maximum pressure: 1.1 MPa (dependent on hardware and bonding method, see table below)
• Vacuum
  • 1e-5 mBar
  • ACP 28G Backing pump with Turbo
• Temperature
  • 20°C to 550°C
  • 45°C/min heating rate
  • Passive cooling (1°C/min)
• Voltage
  • ± 2000 V
  • Up to 50 mA

Substrate Requirements

• Pieces, 100 mm, 150 mm

Material Restrictions

The approved materials listed for the EVG 510 are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the #supported processes section. For any other materials, please create a helpdesk ticket.

The EVG 510 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported Processes

There are currently no characterized processes for the tool.

Maximum force

Bonding processes are characterized by a required pressure (force per area) in order to achieve bonding. The tool recipe specifies a force (in Newtons). This value should be scaled depending on the sample size to achieve the desired pressure. In addition, there is a maximum pressure that may be applied without damaging the equipment, which is dependent on the tooling material and whether the temperature is constant or varying while applying force.

The force value in the recipe should NEVER exceed the maximum force/pressure for the tool conditions. Users will be responsible for any damage caused to equipment if these guidelines are not followed.

The maximum pressure for the tooling available is shown in the following table. To calculate the force (in N), multiply the pressure (in MPa) by the sample area (in mm²).

Pressure Disk Material	Pressure (MPa)
	Steady state	While heating
Ti	3.8	0.5
Quartz	0.6	0.2

Several common sample sizes are shown below. Note that small pieces cannot be used with the quartz plate, because they are below the minimum pressure that the tool can apply (100 N).

Pressure Disk Material	Force (kN)
	150 mm wafer		100 mm wafer		50 mm wafer		10x10 mm piece
	Steady state	While heating	Steady state	While heating	Steady state	While heating	Steady state	While heating
Ti	10	8	10	4	7.5	1	0.4	N/A
Quartz	10	5	5	2	1.25	0.5	N/A	N/A

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

1. Read through this page and the Standard Operating Procedure above.
2. Create a Helpdesk Ticket requesting training.
3. A tool engineer will schedule a time for initial training.
4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
5. Complete the SOP quiz here.
6. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.