EVG 510/Processes

Maximum force

Bonding processes are characterized by a required pressure (force per area) in order to achieve bonding. The tool recipe specifies a force (in Newtons). This value should be scaled depending on the sample size to achieve the desired pressure. In addition, there is a maximum pressure that may be applied without damaging the equipment, which is dependent on the tooling material and whether the temperature is constant or varying while applying force.

The force value in the recipe should NEVER exceed the maximum force/pressure for the tool conditions. Users will be responsible for any damage caused to equipment if these guidelines are not followed.

The maximum pressure for the tooling available is shown in the following table. To calculate the force (in N), multiply the pressure (in MPa) by the sample area (in mm²).

Pressure Disk Material	Pressure (MPa)
	Steady state	While heating
Ti	3.8	0.5
Quartz	0.6	0.2

Several common sample sizes are shown below. Note that small pieces cannot be used with the quartz plate, because they are below the minimum pressure that the tool can apply (100 N).

Pressure Disk Material	Force (kN)
	150 mm wafer		100 mm wafer		50 mm wafer		10x10 mm piece
	Steady state	While heating	Steady state	While heating	Steady state	While heating	Steady state	While heating
Ti	10	8	10	4	7.5	1	0.4	N/A
Quartz	10	5	5	2	1.25	0.5	N/A	N/A