EVG 520IS

EVG 520IS
Equipment Details
Technology	Wafer bonding
Materials Restriction	Metals
Material Processed	Si, Glass
Sample Size	pieces, 100 mm, 150 mm
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Processes
Maintenance	Maintenance

The EVG 520 is a wafer bonder capable of bonding pieces up to 150 mm wafers. It is primarily used for anodic, fusion and thermocompression bonding. Also the CL200 Megasonic Cleaner can be used before bonding to reduce particulate.

All polymer bonding should be performed in the EVG 510

Announcements

• None at this time

Capabilities

• Bonding
  • Anodic
  • Eutectic
  • Thermocompression
  • Fusion

System Overview

Hardware Details

• Force
  • 0 to 60 kN
• Vacuum
  • 1e-5 mBar
  • ACP 28G Backing pump with Turbo
• Temperature
  • 20°C to 550°C
  • 45°C/min heating rate
  • Active cooling (?°C/min)
• Voltage
  • ± 2000 V
  • Up to 50 mA

Substrate Requirements

• Pieces, 100 mm, 150 mm

Material Restrictions

The approved materials listed for the EVG 520IS are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the #supported processes section. For any other materials, please create a helpdesk ticket.

The EVG 520IS is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

The EVG 520IS is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported Processes

The supported processes for this tool are described in detail in the supported processes document. For a specific process the maximum chuck force should not exceed the guidelines below.

Pressure Disk Material	Force (kN)
	150 mm		100 mm		75 mm		50 mm
	Steady State	While Heating	Steady State	While Heating	Steady State	While Heating	Steady State	While Heating
Ti	60	8	30	4	1.5	1.5	6	1
Quartz	10	5	5	2	3	1	2	0.5

Standard Operating Procedure

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Checkout Procedure

1. Read through this page and the Standard Operating Procedure above.
2. Create a Helpdesk Ticket requesting training.
3. A tool engineer will schedule a time for initial training.
4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
5. Complete the SOP quiz here.
6. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Once a week the chucks are cleaned and inspected for damage. A monitor run is performed every other month on a 150 mm wafer to ensure that the tool is in good operating condition.