|Material Processed||Si, Glass|
|Sample Size||pieces, 100 mm, 150 mm|
The EVG 520 is a wafer bonder capable of bonding pieces up to 150 mm wafers. It is primarily used for anodic, fusion and thermocompression bonding. Also the CL200 Megasonic Cleaner can be used before bonding to reduce particulate.
Pressure Plate Schedule
Unless otherwise specified, the default pressure plate will be installed in the tool. For all other pressure plate change requests, please submit a helpdesk ticket at least 2 business days in advance. If there are existing reservations to use the scheduled plate, those will take precedence.
- Default: 6" Ti
- 0.5 to 60 kN
- Maximum pressure: 3.8 MPa (dependent on hardware and bonding method)
- 1e-5 mBar
- ACP 28G Backing pump with Turbo
- 20°C to 550°C
- 45°C/min heating rate
- Active cooling (?°C/min)
- ± 2000 V
- Up to 50 mA
- Pieces, 100 mm, 150 mm
The EVG 520IS is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email email@example.com for any material requests or questions.
There are currently no characterized processes for the tool.
Bonding processes are characterized by a required pressure (force per area) in order to achieve bonding. The tool recipe specifies a force (in Newtons). This value should be scaled depending on the sample size to achieve the desired pressure. In addition, there is a maximum pressure that may be applied without damaging the equipment, which is dependent on the tooling material and whether the temperature is constant or varying while applying force.
The maximum pressure for the tooling available is shown in the following table. To calculate the force (in N), multiply the pressure (in MPa) by the sample area (in mm2).
|Pressure Disk Material||Pressure (MPa)|
|Steady state||While heating|
Several common sample sizes are shown below. Note that small pieces cannot be run in this tool, because they are below the minimum pressure that the tool can apply (500 N).
|Pressure Disk Material||Force (kN)|
|150 mm wafer||100 mm wafer||50 mm wafer||10x10 mm piece|
|Steady state||While heating||Steady state||While heating||Steady state||While heating||Steady state||While heating|
Standard Operating Procedure
This article 's SOP does not follow the LNF Equipment Manual Guidelines.
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- Read through this page and the Standard Operating Procedure above.
- Create a Helpdesk Ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Complete the SOP quiz here.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
This section's factual accuracy is disputed.
Once a week the chucks are cleaned and inspected for damage. A monitor run is performed every other month on a 150 mm wafer to ensure that the tool is in good operating condition.