File:Etch material layers.png

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Revision as of 19:35, 15 March 2021 by Kjvowen (talk | contribs) (Diagram of typical layer stack for an etching process. The top layer is the ''mask'' (for defining the pattern). Beneath is the film to be ''etched''. If the etch reaches the end of this film, the underlying layer is the ''etch stop''. Finally, any material that will not be exposed at any point during the etch is considered ''buried''.)
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Etch_material_layers.png(420 × 170 pixels, file size: 4 KB, MIME type: image/png)

Summary

Diagram of typical layer stack for an etching process. The top layer is the mask (for defining the pattern). Beneath is the film to be etched. If the etch reaches the end of this film, the underlying layer is the etch stop. Finally, any material that will not be exposed at any point during the etch is considered buried.

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current19:35, 15 March 2021Thumbnail for version as of 19:35, 15 March 2021420 × 170 (4 KB)Kjvowen (talk | contribs)Diagram of typical layer stack for an etching process. The top layer is the ''mask'' (for defining the pattern). Beneath is the film to be ''etched''. If the etch reaches the end of this film, the underlying layer is the ''etch stop''. Finally, any material that will not be exposed at any point during the etch is considered ''buried''.
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