Finetech Flip Chip Bonder

Finetech Flip Chip Bonder
	Finetech Lambda Flip Chip Bonder
Equipment Details
Technology	Packaging
Materials Restriction	Undefined
Mask Materials	n/a
Sample Size	maximum sample size 4 cm
Chemicals Used	n/a
Gases Used	n/a
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
User Processes	User Processes
Maintenance	Maintenance

The Finetech Flip Chip Bonder is a state of the art manual chip bonder/aligner.

Announcements

The 200N arm is installed. 10/17/23

Users are no longer allowed to change the pickup tool without super user training.

Capabilities

The lambda (FCB) is designed to position fine pitch devices e.g. flip chip, flip chip assemblies, opto-electronics component, MEMS, sensors, micro optics, etc. The placement accuracy is 0.5 um, and highly reproducible. The bonding techniques available in this tool are: thermo-compression, UV cure bonding, and adhesive bonding of chips. This tool has two types of chip tools: heated and vacuum tools. The tool heating module can heat the chip up to 400C, with a heating ramp of 6 K/s. the maximum chip size is 15x15 mm. LNF has a Chip heated tool 10mmx10mm wich can handle samples as small as 3mm x3 mm. LNF also has two vacuum pick up tool that can be used to place and glue chips using the tool dispenser module. The applied force can be changed from 1 N to 20N and 10N to 200N. The substrate can be heated to 400C, the tool can handle substrates as large as 4 cm x 4cm. The bonding can be done under a reducing atmosphere to prevent oxide formatio during heated indium bonding (Process Gas Module).

The Finetech Fineplacer Lambda is a semiautomatic bonder with full computer control of the bonding parameters and an integrated side-camera system for observation during the bond. Sample sizes as small as 100um on a side to as large as 50mm on a side can be accommodated.

System overview

The flexible FINEPLACER® lambda is a sub-micron die-bonder designed for precision die attach and advanced chip packaging. It is ideal for R&D, prototyping and low-volume production. The system handles a wide range of applications, diode bonding with Indium or Au/Sn, VCSEL/photo diode bonding (glueing, curing) and the multi-stage assembly of opto electro mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.

The LNF tool is completely manual, it has two cameras, top and side. Top camera works with the beam splitter for die/substrate alignment, side camera activates during bonding allowing the operator clear view of the bonding process. It has a 0.1 - 20N adjustable force arm (manual). It has both a substrate and die heating module (80W) that allows heating up to 400 °C at 6 °C/min. This tool is also equipped with a dispenser module which allows the application of adhesive in amounts as small as 1nL with 0.5 micron accuracy. This system can handle both 3 and 5 cc syringes.

Some features

Sub-micron placement accuracy
Unique optical resolution
Handles ultra small components with special tooling
Closed loop force control
Small footprint and compact design
Optics movement with programmable positions
User independent die placement and process operation
Outstanding placement accuracy and instant operation without adjustments
Provides high level of reproducibility and application flexibility
Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
Immediate visual feedback reduces process development time
Fast and easy process development
Process transfer from R&D to production saves time, guarantees reliable results
ROI savings - one machine for all applications

Hardware details

Placement accuracy: ± 0.5 µm
Field of view (min)1: 0.55 mm x 0.45 mm
Field of view (max)1: 6.7 mm x 5.4 mm
Component size (min)1: 0.1 mm x 0.1 mm
Component size (max)1: 15 mm x 15 mm
Theta fine travel: ± 5°
Z-travel 10 mm
Working area1: 190 mm x 52 mm
Bonding force range2*: 0.1 N - 200 N
Heating temperature (max)1,2*: 400 °C
Manual Bonding force Module
Process gas module: forming gas
Dispenser module: for adhesive dispensing
Manual optics shifting: 40 mm
Process video module

Substrate requirements

Substrate size:100mmx100mm
Substrate height: 10 mm

Material restrictions

Materials restrictions practically does not apply for this tool. This a BEOL tool so further contamination is not an issue. The materials issue will have to be considered in prior steps, and relates to bonding materials, temperature budgets and chemical compatibility when considering adhesive bonding.

More than materials users must be aware that in order to align and bond one part (substrate) must fit and be fixed on the stage and the other part, the die, must allow to be picked up by the pickup-tool. Then the design of the pickup tool is crucial for the alignment bonding. All these issues must be considered prior to the training and/or the bonding.

LNF Pick Up tools

LNF Heated and Vacuum tools

finetech Lambda video

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Supported processes

In/Au bonding (In preparation) In/Au bonding/Processes

Standard operating procedure

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Checkout procedure

Read through this page and the Standard Operating Procedure above.
Complete the training request form.
Schedule a time for a training:
1. Find an available time for staff training.
2. Verify that the tool is available in the LNF Online Services at the time you are requesting.
3. After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
4. Create a Helpdesk Ticket for final confirmation of your training appointment. Specify that it is for training in your helpdesk ticket.
Practice with your mentor or another authorized user until you are comfortable with tool operation.
Take the | Flip Chip Bonder Checkout Quiz
Repeat step 3 to schedule a checkout session with a tool engineer. This time specify the appointment is for checkout in your help desk ticket. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

The main issue with maintenance is the Beam Splitter alignment. This is done when minor miss-alignment occurs, if the beam splitter is damaged, completely removed or badly missaligned, finetech service should be called.

Second issue with maintenance in this tool is Load calibration. This is checked and calibrated as needed by staff using a load cell.

Another issue is heated tool damage. In this case tools must be shipped to finetech for repair.

No maintenance should be done by the user, except to leave the work area clean, free of debris, samples, tweezers, etc. and leave all the micrometer in the middle of the range. In addition it is recommended that the force arm is left at the lowest reading, 0.1N