Finetech Flip Chip Bonder
|Finetech Flip Chip Bonder|
|Sample Size||maximum sample size 4 cm|
|Supported Processes||Supported Processes|
|User Processes||User Processes|
The Finetech Flip Chip Bonder is a...
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The lambda (FCB) is designed to position fine pitch devices e.g. flip chip, flip chip assemblies, opto-electronics component, MEMS, sensors, micro optics, etc. The placement accuracy is 0.5 um, and highly reproducible. The bonding techniques available in this tool are: thermo-compression, UV cure bonding, and adhesive bonding of chips. This tool has two types of chip tools: heated and vacuum tools. The tool heating module can heat the chip up to 400C, with a heating ramp of 6 K/s. the maximum chip size is 15x15 mm. LNF has a Chip heated tool 10mmx10mm wich can handle samples as small as 3mm x3 mm. LNF also has two vacuum pick up tool that can be used to place and glue chips using the tool dispenser module. The applied force can be changed from 1 N to 10N. The substrate can be heated to 400C, the tool can handle substrates as large as 4 cm x 4cm. The bonding can be done under a reducing atmosphere to prevent oxide formatio during heated indium bonding (Process Gas Module).
The Finetech Fineplacer Lambda is a semiautomatic bonder with full computer control of the bonding parameters and an integrated side-camera system for observation during the bond. Sample sizes as small as 100um on a side to as large as 50mm on a side can be accommodated.
The flexible FINEPLACER® lambda is a sub-micron die-bonder designed for precision die attach and advanced chip packaging. It is ideal for R&D, prototyping and low-volume production. The system handles a wide range of applications, diode bonding with Indium or Au/Sn, VCSEL/photo diode bonding (glueing, curing) and the multi-stage assembly of opto electro mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.
The LNF tool is completely manual, it has two cameras, top and side. Top camera works with the beam splitter for die/substrate alignment, side camera activates during bonding allowing the operator clear view of the bonding process. It has a 0.1 - 20N adjustable force arm (manual). It has both a substrate and die heating module (80W) that allows heating up to 400 °C at 6 °C/min. This tool is also equipped with a dispenser module which allows the application of adhesive in amounts as small as 1nL with 0.5 micron accuracy. This system can handle both 3 and 5 cc syringes.
- Sub-micron placement accuracy
- Unique optical resolution
- Handles ultra small components with special tooling
- Closed loop force control
- Small footprint and compact design
- Optics movement with programmable positions
- User independent die placement and process operation
- Outstanding placement accuracy and instant operation without adjustments
- Provides high level of reproducibility and application flexibility
- Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
- Immediate visual feedback reduces process development time
- Fast and easy process development
- Process transfer from R&D to production saves time, guarantees reliable results
- ROI savings - one machine for all applications
- Placement accuracy: ± 0.5 µm
- Field of view (min)1: 0.55 mm x 0.45 mm
- Field of view (max)1: 6.7 mm x 5.4 mm
- Component size (min)1: 0.1 mm x 0.1 mm
- Component size (max)1: 15 mm x 15 mm
- Theta fine travel: ± 5°
- Z-travel 10 mm
- Working area1: 190 mm x 52 mm
- Bonding force range2*: 0.1 N - 400 N
- Heating temperature (max)1,2*: 400 °C
- Manual Bonding force Module
- Process gas module: forming gas
- Dispenser module: for adhesive dispensing
- Manual optics shifting: 40 mm
- Process video module
- Substrate size:100mmx100mm
- Substrate height: 10 mm
Materials restrictions practically does not apply for this tool. This a BEOL tool so further contamination is not an issue. The materials issue will have to be considered in prior steps, and relates to bonding materials, temperature budgets and chemical compatibility when considering adhesive bonding.
More than materials users must be aware that in order to align and bond one part (substrate) must fit and be fixed on the stage and the other part, the die, must allow to be picked up by the pickup-tool. Then the design of the pickup tool is crucial for the alignment bonding. All these issues must be considered prior to the training and/or the bonding.
LNF Pick Up tools
finetech Lambda video
- In/Au bonding
Standard operating procedure
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- Read through this page and the Standard Operating Procedure above.
- Complete the training request form .
- Create a Helpdesk Ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
The main issue with maintenance is the Beam Splitter alignment. This is done when minor miss-alignment occurs, if the beam splitter is damaged, completely removed or badly missaligned, finetech service should be called.
Second issue with maintenance in this tool is Load calibration. This is checked and calibrated as needed by staff using a load cell.
Another issue is heated tool damage. In this case tools must be shipped to finetech for repair.
No maintenance should be done by the user, except to leave the work area clean, free of debris, samples, tweezers, etc. and leave all the micrometer in the middle of the range. In addition it is recommended that the force arm is left at the lowest reading, 0.1N