Difference between revisions of "GCA AS200 AutoStep"
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| − | + | {{#vardefine:toolid|51000}} {{#vardefine:technology|Lithography}} {{#vardefine:restriction|4}} | |
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{{infobox equipment | {{infobox equipment | ||
|caption = | |caption = | ||
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|mask =5" | |mask =5" | ||
|size = | |size = | ||
| − | + | |overview = [[{{PAGENAME}}#System overview | System overview]] | |
| − | + | |sop = [https://docs.google.com/document/d/1znEkxEo7a1avN68OaWswpK5i7lHbAY4Ew_4dtemibC8/preview SOP] | |
| − | |overview = [[{{PAGENAME}}# | ||
| − | |sop = [ | ||
|processes = [[{{PAGENAME}}/Processes|Supported Processes]] | |processes = [[{{PAGENAME}}/Processes|Supported Processes]] | ||
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]] | |userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]] | ||
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==Capabilities== | ==Capabilities== | ||
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* 400nm isolated lines, 500nm gratings and isolated trenches | * 400nm isolated lines, 500nm gratings and isolated trenches | ||
* 10 mm pieces up to 6" wafers | * 10 mm pieces up to 6" wafers | ||
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* 14 mm max die size | * 14 mm max die size | ||
| + | * Several chuck sizes available | ||
| + | ** 10mm - (380-580 µm) | ||
| + | ** 2" - (205-405 µm), (385-585 µm) | ||
| + | ** 4" - (150-350 µm), (405-605 µm), (555-755 µm), 635-835 µm), (895-1095 µm), (1175-1375 µm) | ||
| + | ** 6" - (560-760 µm), (860-1060 µm) | ||
==System overview== | ==System overview== | ||
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* Automatic reticle (mask) alignment. Automatic wafer handling for 4" wafers | * Automatic reticle (mask) alignment. Automatic wafer handling for 4" wafers | ||
* Atmospheric compensation system controlled to within 0.1 °C | * Atmospheric compensation system controlled to within 0.1 °C | ||
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===Material restrictions=== | ===Material restrictions=== | ||
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==Standard operating procedure== | ==Standard operating procedure== | ||
| − | * [https:// | + | * [https://docs.google.com/document/d/1znEkxEo7a1avN68OaWswpK5i7lHbAY4Ew_4dtemibC8/preview Equipment Manual] |
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===Templates=== | ===Templates=== | ||
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The local mark can be anywhere on the die. | The local mark can be anywhere on the die. | ||
| − | *[https://drive.google.com/file/d/1OatRgRl-kUmPXKUWyc7JUpSygPgY94Si/view?usp=sharing | + | *[https://drive.google.com/file/d/1OatRgRl-kUmPXKUWyc7JUpSygPgY94Si/view?usp=sharing Segmented µDFAS Mark] |
| − | + | *[https://drive.google.com/file/d/1Xn6ssmoe5iGq8NX9jWPVBilyMgaMR1z_/view?usp=sharing Non-Segmented µDFAS Mark] | |
Note: If you have questions about mask design please make a helpdesk ticket before making the mask. | Note: If you have questions about mask design please make a helpdesk ticket before making the mask. | ||
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<!-- Describe the checkout procedure for the tool. For example: --> | <!-- Describe the checkout procedure for the tool. For example: --> | ||
# Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again. | # Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again. | ||
| − | # Read through | + | # Read through the [https://docs.google.com/document/d/1znEkxEo7a1avN68OaWswpK5i7lHbAY4Ew_4dtemibC8/preview Equipment Manual]. |
| + | # Accurately complete the [https://docs.google.com/forms/d/e/1FAIpQLSdrTjtsOnnot5_lngONj9JiTi8A6TrKoqWIVIOzkhVmIgM35Q/viewform checkout quiz]. You may retake as necessary until all answers are correct. | ||
| + | # Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training. | ||
# If possible, practice with your mentor or another authorized user until you are comfortable with tool operation. | # If possible, practice with your mentor or another authorized user until you are comfortable with tool operation. | ||
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# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool. | # Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool. | ||
Latest revision as of 09:30, 26 October 2021
| GCA AS200 AutoStep | |
|---|---|
 | |
| Equipment Details | |
| Technology | Lithography |
| Materials Restriction | General |
| Material Processed | All LNF approved photoresists |
| Mask Materials | 5" |
| Equipment Manual | |
| Overview | System overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| User Processes | User Processes |
| Maintenance | Maintenance |
The GCA AS200 AutoStep is a submicron capable projection lithography 5X reduction exposure system. The system can automatically perform all wafer processing and handling operations of 4" wafers and can be used to align and expose pieces. It is primarily used to expose an array of images directly onto the surface of a wafer.
Contents
Capabilities
- 400nm isolated lines, 500nm gratings and isolated trenches
- 10 mm pieces up to 6" wafers
- 14 mm max die size
- Several chuck sizes available
- 10mm - (380-580 µm)
- 2" - (205-405 µm), (385-585 µm)
- 4" - (150-350 µm), (405-605 µm), (555-755 µm), 635-835 µm), (895-1095 µm), (1175-1375 µm)
- 6" - (560-760 µm), (860-1060 µm)
System overview
Hardware details
- 5x reduction i-line(λ = 365 nm) stepper.
- Lens: Tropel 2145: 21 mm circular field on wafer, NA = 0.45
- Constant power light source corrected to about 500 mJ/sec
- Automatic reticle (mask) alignment. Automatic wafer handling for 4" wafers
- Atmospheric compensation system controlled to within 0.1 °C
Material restrictions
The GCA AS200 AutoStep is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Approved materials
Supported processes
Exposure of all LNF approved photoresists are allowed on this tool in accordance with standard operating procedure. More data on exposure times can be found on datasheet for the specific photoresist. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
Templates
These 2mm windows are used to align the reticle onto the column and must be centered on the mask plate.
- Layout (5X Reduction)
The global marks can be anywhere on the die, but spacing them so that they are 3" apart on the wafer is more convenient.
The local mark can be anywhere on the die.
Note: If you have questions about mask design please make a helpdesk ticket before making the mask.
Checkout procedure
- Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
- Read through the Equipment Manual.
- Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
- Create a Helpdesk Ticket requesting training.
- If possible, practice with your mentor or another authorized user until you are comfortable with tool operation.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
