Difference between revisions of "GCA AS200 AutoStep"

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==Capabilities==
 
==Capabilities==
 
<!--A more general description of what the tool is capable of doing.-->
 
<!--A more general description of what the tool is capable of doing.-->
* EtchRate
+
* 0.75 um resoution across field(current-see announcement) 0.5 um overlay accuracy (current)
* Resolution
+
* 10 mm pieces up to 6" wafers
* Aspect Ratio
+
* Substrate thicknesses (with existing chucks) 175-675 um (the range from 400-475 um thick may not work)
* Thickness range
+
* High resolution/high precision mask making possible if there's interest
  
 
==System overview==
 
==System overview==

Revision as of 14:02, 25 August 2015

GCA AS200 AutoStep
51000.jpg
Equipment Details
Technology Projection Lithography
Materials Restriction Semi-Clean
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.

The GCA AS200 Auto Step is a submicron capable projection lithography 5X reduction exposure system. The system can automatically perform all wafer processing and handling operations of 4" wafers and can be used to align and expose pieces. It is primarily used to expose an array of images directly onto the surface of a wafer.


Announcements

  • Update this with announcements as necessary

Capabilities

  • 0.75 um resoution across field(current-see announcement) 0.5 um overlay accuracy (current)
  • 10 mm pieces up to 6" wafers
  • Substrate thicknesses (with existing chucks) 175-675 um (the range from 400-475 um thick may not work)
  • High resolution/high precision mask making possible if there's interest

System overview

Hardware details

  • Gases
  • Pressure
  • Chuck
  • Chamber
  • RF / Power Specs
  • Chemicals

Substrate requirements

  • Wafer Size
  • Wafer type
  • Any mounting?
  • Wafer thickness

Material restrictions

The GCA AS200 AutoStep is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on GCA AS200 AutoStep user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Complete the training request form here.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for initial training.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the SOP quiz here.
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Process name