GCA AS200 AutoStep

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GCA AS200 AutoStep
Equipment Details
Technology Lithography
Materials Restriction Semi-Clean
Material Processed All LNF approved photoresists
Mask Materials 5"
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance

The GCA AS200 AutoStep is a submicron capable projection lithography 5X reduction exposure system. The system can automatically perform all wafer processing and handling operations of 4" wafers and can be used to align and expose pieces. It is primarily used to expose an array of images directly onto the surface of a wafer.


  • 400nm isolated lines, 500nm gratings and isolated trenches
  • 10 mm pieces up to 6" wafers
  • Substrate thicknesses (with existing chucks) 175-675 μm (the range from 400-475 μm thick may not work)
  • 14 mm max die size

System overview

Hardware details

  • 5x reduction i-line(λ = 365 nm) stepper.
  • Lens: Tropel 2145: 21 mm circular field on wafer, NA = 0.45
  • Constant power light source corrected to about 500 mJ/sec
  • Automatic reticle (mask) alignment. Automatic wafer handling for 4" wafers
  • Atmospheric compensation system controlled to within 0.1 °C

Substrate requirements

  • 10 mm pieces up to 6" diameter
  • Substrate thicknesses (with existing chucks) 175-675 μm (the range from 400-475 μm thick may not work with existing chucks)
  • 4" Si substrates can be autoloaded and prealigned. Various other substrates permitted, but must be manually loaded
  • Mounting not necessary unless one is trying to achieve a useable thickness. Make a helpdesk ticket for assistance if needed

Material restrictions

The GCA AS200 AutoStep is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Supported processes

Exposure of all LNF approved photoresists are allowed on this tool in accordance with standard operating procedure. More data on exposure times can be found on datasheet for the specific photoresist. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure


These 2mm windows are used to align the reticle onto the column and must be centered on the mask plate.

The global marks can be anywhere on the die, but spacing them so that they are 3" apart on the wafer is more convenient.

The local mark can be anywhere on the die.

Note: If you have questions about mask design please make a helpdesk ticket before making the mask.

Checkout procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Read through this page and the Standard Operating Procedure above.
  3. Create a Helpdesk Ticket requesting training.
  4. If possible, practice with your mentor or another authorized user until you are comfortable with tool operation.
  5. A tool engineer will schedule a time for initial training.
  6. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.