GCA AS200 AutoStep
|GCA AS200 AutoStep|
|Material Processed||All LNF approved photoresists|
|Supported Processes||Supported Processes|
|User Processes||User Processes|
The GCA AS200 AutoStep is a submicron capable projection lithography 5X reduction exposure system. The system can automatically perform all wafer processing and handling operations of 4" wafers and can be used to align and expose pieces. It is primarily used to expose an array of images directly onto the surface of a wafer.
- 400nm isolated lines, 500nm gratings and isolated trenches
- 10 mm pieces up to 6" wafers
- 14 mm max die size
- Several chuck sizes available
- 10mm - (380-580 µm)
- 2" - (205-405 µm), (385-585 µm)
- 4" - (150-350 µm), (405-605 µm), (555-755 µm), 635-835 µm), (895-1095 µm), (1175-1375 µm)
- 6" - (560-760 µm), (860-1060 µm)
- 5x reduction i-line(λ = 365 nm) stepper.
- Lens: Tropel 2145: 21 mm circular field on wafer, NA = 0.45
- Constant power light source corrected to about 500 mJ/sec
- Automatic reticle (mask) alignment. Automatic wafer handling for 4" wafers
- Atmospheric compensation system controlled to within 0.1 °C
- 10 mm pieces up to 6" diameter
- Substrate thicknesses (with existing chucks) 175-675 μm (the range from 400-475 μm thick may not work with existing chucks)
- 4" Si substrates can be autoloaded and prealigned. Various other substrates permitted, but must be manually loaded
- Mounting not necessary unless one is trying to achieve a useable thickness. Make a helpdesk ticket for assistance if needed
The GCA AS200 AutoStep is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email firstname.lastname@example.org for any material requests or questions.
Exposure of all LNF approved photoresists are allowed on this tool in accordance with standard operating procedure. More data on exposure times can be found on datasheet for the specific photoresist. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
These 2mm windows are used to align the reticle onto the column and must be centered on the mask plate.
- Layout (5X Reduction)
The global marks can be anywhere on the die, but spacing them so that they are 3" apart on the wafer is more convenient.
The local mark can be anywhere on the die.
Note: If you have questions about mask design please make a helpdesk ticket before making the mask.
- Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
- Read through the Equipment Manual.
- Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
- Create a Helpdesk Ticket requesting training.
- If possible, practice with your mentor or another authorized user until you are comfortable with tool operation.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.