GCA AS200 AutoStep

From LNF Wiki
Jump to navigation Jump to search
GCA AS200 AutoStep
51000.jpg
Equipment Details
Technology Projection Lithography
Materials Restriction Semi-Clean
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.

The GCA AS200 Auto Step is a submicron capable projection lithography 5X reduction exposure system. The system can automatically perform all wafer processing and handling operations of 4" wafers and can be used to align and expose pieces. It is primarily used to expose an array of images directly onto the surface of a wafer.


Announcements

LNF is now under contract with SCS, Inc. They will be servicing and optimizing our system over the course of the next year or so. They've stated they can achieve 0.5 um resolution across field with local alignment accuracy better than 0.25 um once repairs and optimization are completed. We'll keep users posted. Their first service visit is scheduled for the week of 9/14/15. The tool will be offline for the first half of the week. Please plan accordingly.

Capabilities

  • 0.75 um resoution across field(current-see announcement) 0.5 um overlay accuracy (current)
  • 10 mm pieces up to 6" wafers
  • Substrate thicknesses (with existing chucks) 175-675 um (the range from 400-475 um thick may not work)
  • 14 mm max die size (current)
  • High resolution/high precision mask making possible if there's interest

System overview

Hardware details

  • 5x reduction i-line(λ = 365 nm) stepper.
  • Lens: Tropel 2145: 21mm circular field on wafer, NA = 0.45
  • Constant power light source corrected to about 500 mJ/sec
  • Automatic reticle (mask) alignment. Automatic wafer handling for 4" wafers
  • Atmospheric compensation system controlled to within 0.1 °C

Substrate requirements

  • 10 mm pieces up to 6" diameter
  • Substrate thicknesses (with existing chucks) 175-675 um (the range from 400-475 um thick may not work with existing chucks)
  • 4" Si substrates can be autoloaded and prealigned. Various other substrates permitted, but must be manually loaded
  • Mounting not necessary unless one is trying to achieve a useable thickness. Make a helpdesk ticket for assistance if needed

Material restrictions

The GCA AS200 AutoStep is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on GCA AS200 AutoStep user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Complete the training request form here.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for initial training.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the SOP quiz here.
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Process name