Difference between revisions of "GSI PECVD"

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{{infobox equipment
{{infobox equipment
|caption =  
|caption = GSI ULTRA 2000 PECVD
|materials = [[Silicon dioxide|SiO<sub>2</sub>]], [[Silicon nitride|Si<sub>3</sub>N<sub>3</sub>]], [[Silicon oxynitride|SiO<sub>x</sub>N<sub>y</sub>]]
|materials = [[Silicon dioxide|SiO<sub>2</sub>]], [[Silicon nitride|Si<sub>3</sub>N<sub>3</sub>]], [[Silicon oxynitride|SiO<sub>x</sub>N<sub>y</sub>]]
|mask =
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{{warning|This page has not been released yet.}}
{{warning|This page has not been released yet.}}
<!-- Insert the tool description here -->
<!-- The GSI is a Plasma Enhanced Chemical Vapor Deposition (PECVD) system configured to deposit SiO2, Si3N4, and SiOxNy on substrates up to 100mm diameter.  This is a single wafer system that deposits film on one side of the substrate at a time. Deposition temperature may range from 100C to 380C. Standard recipes deposit at 200C or 380C. Substrate heating is accomplished with the utilization of a heater block. The heater block does not contain active cooling. This system includes a dual frequency RF power delivery system with 13.56MHz as the primary power component. High frequency utilizes an auto-matching network w/ built in V/I probe on the output and low frequency utilizes a fixed matching network. The 13.56MHz is superimposed onto the 420KHz (when RF1 and RF2 are both used) and is capacitively coupled through the showerhead electrode. A wafer carrier must be used for 100mm and smaller substrates. All component parameters (except temperature) are displayed in system interface as percentage of full scale (ex. RF1 set to 32 is interpreted as 32% of 1000W’s or 320W’s). -->

Revision as of 10:13, 21 April 2015

Equipment Details
Technology PECVD
Materials Restriction Semi-Clean
Material Processed SiO2, Si3N3, SiOxNy
Sample Size 100mm and Pieces
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance

Warning Warning: This page has not been released yet.


  • Update this with announcements as necessary


  • Etch Rate
  • Resolution
  • Aspect Ratio
  • Thickness range

System Overview

Hardware Details

  • Gases
  • Pressure
  • Chuck
  • Chamber
  • RF / Power Specs
  • Chemicals

Substrate Requirements

  • Wafer Size
  • Wafer type
  • Any mounting?
  • Wafer thickness

Material Restrictions

The GSI PECVD is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Supported Processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on GSI PECVD User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Complete the training request form here.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for initial training.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the SOP quiz here.
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Tool Qualification

Process Name