Glen 1000P Plasma Cleaner

The Glen 1000P Plasma Cleaner is a 1000 Watt parallel plate plasma cleaning system designed to give uniform plasma over up to four large (16 x 16-inch) sample trays. It has three plasma gas inputs and an inert gas input to enable the chamber contents to be bought back to atmospheric pressure in a controlled environment. The system has 10 recipes selectable using pushbuttons on the front of the tool.

Glen 1000P Plasma Cleaner
Equipment Details
Technology	Plasma etching
Materials Restriction	Metals
Gases Used	O2, Ar, CF4
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
Maintenance	Maintenance

Contents

Announcements

July 1, 2025: N₂ plumbing

  N2 has replaced CF4 as Gas 1.
  Recipe 50 has been released as an N2 ash at 300W for 120 sec
  The SOP has been edited to reflect these changes

Also, be careful when moving trays around. Most of the connectors are in precarious conditions, the floating trays tabs, especially, are delicate easy to break.

Capabilities

• Photoresist Descum/Ashing
• Cleaning prior to electroplating
• Organics removal
• Surface activation of PDMS prior to bonding
• Etching (mild)

System overview

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Hardware details

• 1000 watt RF generator operating at 40 kHz
• Process Gases: N₂, Ar, and O₂, metered by Mass Flow Controllers (0-100 sccm). N₂ for vent and purge gas, and pneumatic control
• Plasma generated between 120-180 mTorr, controlled by gas flow into chamber.
• Chamber can accommodate up to 14 trays
• Active, ground, and floating trays 16"x 16"
  • See SOP for description of trays and their uses

• 

  Active tray

• 

  Ground tray

• 

  Floating tray

Substrate requirements

There are no restrictions on substrate size or type in this tool.

Material restrictions

The Glen 1000P Plasma Cleaner is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

There are several processes for this tool supported by the LNF.

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Changing the plasma time is the only recipe editing that is permitted in this tool. Please see tool engineer if you need to edit plasma time. Please restore the recipe to the original time after your processing is complete. If you are curious if your material can be processed in this tool or have other special requirements, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

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Checkout procedure

1. Read through this page and the Standard Operating Procedure above.
2. Create a Helpdesk Ticket requesting training.
3. A tool engineer will schedule a time for initial training.
4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Trays are removed and chamber is wiped clean with IPA regularly. Door seal is inspected regularly. Vacuum pump oil is changed yearly.

Common problems

Tool will not vent: Check that your reservation is active. Chamber will not vent without an active reservation (green scheduler light must be lit)

Tool aborts immediately after process start: Check that vacuum pump is turned on. The tool must achieve 700 Torr chamber pressure within 6 seconds after process start. If this occurs, press the red “Reset/Load” button, turn on the vacuum pump and start process again

Tool aborts 3 minutes after process start: The tool must achieve 150 mTorr chamber pressure within 180 seconds in order to flow plasma gas. This abort is usually caused by debris on the door seal which interferes with chamber pumping. If this occurs, vent the chamber and clean the door seal (Orange O-ring) with a lint free wipe and IPA. Then begin your process again. This can also be caused by excessive chamber heating with prolonged processing at high plasma power. You must wait until the chamber cools before additional processing if this occurs.