Difference between revisions of "Gold"

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===Deposition Equipment===
===Deposition Equipment===
**[[Lab 18-2]]
*[[Lab 18-2]]
**[[Enerjet Evaporator]]
*[[Enerjet Evaporator]]
**[[Cooke Evaporator]]
*[[Cooke Evaporator]]
**[[SJ-20 Evaporator]]
*[[SJ-20 Evaporator]]
**[[Angstrom Engineering Evovac Evaporator]]
*[[Angstrom Engineering Evovac Evaporator]]
===Etching Equipment===
===Etching Equipment===
**[[Acid Bench 12]]
*[[Acid Bench 12]]
**[[Acid Bench 73]]
*[[Acid Bench 73]]
**[[Acid Bench 82]]
*[[Acid Bench 82]]
**[[Plasmatherm 790]]
*[[Plasmatherm 790]]
**[[STS Glass Etcher]]
*[[STS Glass Etcher]]
* List of equipment for processing this material
* List of equipment for processing this material

Revision as of 11:14, 1 April 2020

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Material Details
Material Restriction Metals

Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.


Discuss common uses/applications for this material.

Processing Tools

Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.

Deposition Equipment

Etching Equipment

  • List of equipment for processing this material



Evaporated Gold

Plated Gold

Sputtered Gold

Etch Processes

Wet etching

Wet etching is done by using Transene Gold Etch 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]