Difference between revisions of "Gold"
| Line 20: | Line 20: | ||
===Deposition Equipment=== | ===Deposition Equipment=== | ||
| − | + | *[[Lab 18-2]] | |
| − | + | *[[Enerjet Evaporator]] | |
| − | + | *[[Cooke Evaporator]] | |
| − | + | *[[SJ-20 Evaporator]] | |
| − | + | *[[Angstrom Engineering Evovac Evaporator]] | |
===Etching Equipment=== | ===Etching Equipment=== | ||
| − | + | *[[Acid Bench 12]] | |
| − | + | *[[Acid Bench 73]] | |
| − | + | *[[Acid Bench 82]] | |
| − | + | *[[Plasmatherm 790]] | |
| − | + | *[[STS Glass Etcher]] | |
* List of equipment for processing this material | * List of equipment for processing this material | ||
Revision as of 11:14, 1 April 2020
 Warning: | This page has not been released yet. |
| Gold | |
|---|---|
| Material Details | |
| Material Restriction | Metals |
Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.
Contents
Applications
Discuss common uses/applications for this material.
Processing Tools
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
Deposition Equipment
- Lab 18-2
- Enerjet Evaporator
- Cooke Evaporator
- SJ-20 Evaporator
- Angstrom Engineering Evovac Evaporator
Etching Equipment
- List of equipment for processing this material
Processes
Deposition
Evaporated Gold
Plated Gold
Sputtered Gold
Etch Processes
Wet etching
Wet etching is done by using Transene Gold Etch 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]
