Difference between revisions of "Gold"

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Gold is generally used for conductive layers and occasionally in bonding applications.  Due to its high mobility it is not allowed in most semiconductor equipment.
 
Gold is generally used for conductive layers and occasionally in bonding applications.  Due to its high mobility it is not allowed in most semiconductor equipment.
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==Processing Equipment==
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Process technologies that can be used to deposit/pattern this material.  If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
  
 
==Applications==
 
==Applications==
 
Discuss common uses/applications for this material.
 
Discuss common uses/applications for this material.
 
==Processing Tools==
 
Process technologies that can be used to deposit/pattern this material.  If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
 
 
 
===Deposition Equipment===
 
===Deposition Equipment===
 
*[[Lab 18-2]]
 
*[[Lab 18-2]]

Revision as of 10:05, 8 April 2020

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Gold
Material Details
Material Restriction Metals



Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.

Processing Equipment

Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.

Applications

Discuss common uses/applications for this material.

Deposition Equipment

Etching Equipment

  • List of equipment for processing this material

Processes

Deposition

Etch Processes

Wet etching

  • Wet etching is done by using Transene Gold Etch 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]

References