Difference between revisions of "Gold"

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*[[STS Glass Etcher]]
 
*[[STS Glass Etcher]]
 
==Applications==
 
==Applications==
Discuss common uses/applications for this material.
+
*Conduting Layer
 +
*Bond Pads
 +
*Bonding material for [[Eutectic bonding]] or [[Thermal Compression bonding]].
  
 
==Processes==
 
==Processes==

Revision as of 10:09, 8 April 2020

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Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.

Processing Equipment

Deposition Equipment

Etching Equipment

Applications

Processes

Deposition

Etch Processes

  • Wet etching
    • Wet etching is done by using Transene Gold Etch 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]

References