Difference between revisions of "Gold"

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{{warning|This page has not been released yet.}}
 
{{warning|This page has not been released yet.}}
 
{{#vardefine:restriction|3}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies -->
 
{{#vardefine:restriction|3}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies -->
Gold is generally used for conductive layers and occasionally in bonding applications.  Due to its high mobility it is not allowed in most semiconductor equipment.
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Gold is generally used for conductive layers and occasionally in bonding applications.  Due to its high mobility it is not allowed in most semiconductor equipment. Gold is commonly refereed to by it's atomic symbol Au.
  
 
==Processing Equipment==
 
==Processing Equipment==
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*[[STS Glass Etcher]]
 
*[[STS Glass Etcher]]
 
==Applications==
 
==Applications==
Discuss common uses/applications for this material.
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*Conducting Layer
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*Bond Pads
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*Bonding material for [[Eutectic bonding]] or [[Thermal Compression bonding]].
  
 
==Processes==
 
==Processes==
===Deposition===
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===Deposition Processes===
 
*[[Electron_beam_evaporation|E-beam evaporation]]
 
*[[Electron_beam_evaporation|E-beam evaporation]]
 
*[[Sputter_deposition|Sputter deposition]]
 
*[[Sputter_deposition|Sputter deposition]]
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==References==
 
==References==
*[http://en.wikipedia.org/wiki/Gold Wikipedia Gold]
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*[http://en.wikipedia.org/wiki/ Wikipedia: Gold]

Latest revision as of 11:53, 8 April 2020

Warning Warning: This page has not been released yet.

Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment. Gold is commonly refereed to by it's atomic symbol Au.

Processing Equipment

Deposition Equipment

Etching Equipment

Applications

Processes

Deposition Processes

Etch Processes

  • Wet etching
    • Wet etching is done by using Transene Gold Etch 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]

References