Difference between revisions of "Gold"
Jump to navigation
Jump to search
| (3 intermediate revisions by the same user not shown) | |||
| Line 3: | Line 3: | ||
{{warning|This page has not been released yet.}} | {{warning|This page has not been released yet.}} | ||
{{#vardefine:restriction|3}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies --> | {{#vardefine:restriction|3}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies --> | ||
| − | Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment. | + | Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment. Gold is commonly refereed to by it's atomic symbol Au. |
==Processing Equipment== | ==Processing Equipment== | ||
| Line 20: | Line 20: | ||
*[[STS Glass Etcher]] | *[[STS Glass Etcher]] | ||
==Applications== | ==Applications== | ||
| − | * | + | *Conducting Layer |
*Bond Pads | *Bond Pads | ||
*Bonding material for [[Eutectic bonding]] or [[Thermal Compression bonding]]. | *Bonding material for [[Eutectic bonding]] or [[Thermal Compression bonding]]. | ||
==Processes== | ==Processes== | ||
| − | ===Deposition=== | + | ===Deposition Processes=== |
*[[Electron_beam_evaporation|E-beam evaporation]] | *[[Electron_beam_evaporation|E-beam evaporation]] | ||
*[[Sputter_deposition|Sputter deposition]] | *[[Sputter_deposition|Sputter deposition]] | ||
| Line 35: | Line 35: | ||
==References== | ==References== | ||
| − | *[http://en.wikipedia.org/wiki/ | + | *[http://en.wikipedia.org/wiki/ Wikipedia: Gold] |
Latest revision as of 11:53, 8 April 2020
 Warning: | This page has not been released yet. |
Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment. Gold is commonly refereed to by it's atomic symbol Au.
Contents
Processing Equipment
Deposition Equipment
- Lab 18-2
- Enerjet Evaporator
- Cooke Evaporator
- SJ-20 Evaporator
- Angstrom Engineering Evovac Evaporator
Etching Equipment
Applications
- Conducting Layer
- Bond Pads
- Bonding material for Eutectic bonding or Thermal Compression bonding.
Processes
Deposition Processes
Etch Processes
- Wet etching
- Wet etching is done by using Transene Gold Etch 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]
