Difference between revisions of "Gold"

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[[Category:Materials]]
 
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{{Infobox material
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Gold is generally used for conductive layers and occasionally in bonding applications.  Due to its high mobility it is not allowed in most semiconductor equipment. Gold is commonly refereed to by it's atomic symbol Au.
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Gold is generally used for conductive layers and occasionally in bonding applications.  Due to its high mobility it is not allowed in most semiconductor equipment.
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==Processing Equipment==
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===Deposition Equipment===
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*[[Lab 18-2]]
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*[[Enerjet Evaporator]]
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*[[Cooke Evaporator]]
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*[[SJ-20 Evaporator]]
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*[[Angstrom Engineering Evovac Evaporator]]
  
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===Etching Equipment===
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*[[Acid Bench 12]]
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*[[Acid Bench 73]]
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*[[Acid Bench 82]]
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*[[Plasmatherm 790]]
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*[[STS Glass Etcher]]
 
==Applications==
 
==Applications==
Discuss common uses/applications for this material.
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*Conducting Layer
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*Bond Pads
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*Bonding material for [[Eutectic bonding]] or [[Thermal Compression bonding]].
  
==Processing Tools==
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==Processes==
Process technologies that can be used to deposit/pattern this material.  If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
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===Deposition Processes===
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*[[Electron_beam_evaporation|E-beam evaporation]]
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*[[Sputter_deposition|Sputter deposition]]
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*[[Gold Plating]]
  
===Equipment===
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===Etch Processes===
*Deposition
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*[[Wet etching]]
**[[Lab 18-2]]
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**Wet etching is done by using Transene [[Gold Etch]] 8111.  Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting.  Gold etchant is potassium iodide and iodine based.  You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]
**[[Enerjet evaporator]]
 
**[[Cooke Evaporator]]
 
**[[SJ-20 Evaporator]]
 
**[[SJ-26 Evaporator]]
 
*Etching
 
**[[Acid Bench 12]]
 
** RIE tools?
 
* List of equipment for processing this material
 
 
 
===Processes===
 
* List of chemical (or otherwise) processes for this material
 
  
 
==References==
 
==References==
*[http://en.wikipedia.org/wiki/Gold Gold]
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*[http://en.wikipedia.org/wiki/ Wikipedia: Gold]

Latest revision as of 11:53, 8 April 2020

Warning Warning: This page has not been released yet.

Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment. Gold is commonly refereed to by it's atomic symbol Au.

Processing Equipment

Deposition Equipment

Etching Equipment

Applications

Processes

Deposition Processes

Etch Processes

  • Wet etching
    • Wet etching is done by using Transene Gold Etch 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]

References