Difference between revisions of "Gold"
Jump to navigation
Jump to search
| Line 24: | Line 24: | ||
**[[Cooke Evaporator]] | **[[Cooke Evaporator]] | ||
**[[SJ-20 Evaporator]] | **[[SJ-20 Evaporator]] | ||
| − | **[[ | + | **[[SJ-26 Evaporator]] |
*Etching | *Etching | ||
**[[Acid Bench 12]] | **[[Acid Bench 12]] | ||
Revision as of 09:50, 23 April 2015
 Warning: | This page has not been released yet. |
| Gold | |
|---|---|
| Material Details | |
| Material Restriction | Metals |
Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.
Applications
Discuss common uses/applications for this material.
Processing Tools
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
Equipment
- Deposition
- Etching
- Acid Bench 12
- RIE tools?
- List of equipment for processing this material
Processes
- List of chemical (or otherwise) processes for this material
