Difference between revisions of "Gold"

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*Deposition
 
*Deposition
 
**[[Lab 18-2]]
 
**[[Lab 18-2]]
**[[Enerjet evaporator]]
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**[[Enerjet Evaporator]]
 
**[[Cooke Evaporator]]
 
**[[Cooke Evaporator]]
 
**[[SJ-20 Evaporator]]
 
**[[SJ-20 Evaporator]]

Revision as of 10:16, 4 May 2015

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Gold
Material Details
Material Restriction Metals



Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.

Applications

Discuss common uses/applications for this material.

Processing Tools

Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.

Equipment

Processes

  • List of chemical (or otherwise) processes for this material

References