Difference between revisions of "Gold"
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==Processes== | ==Processes== | ||
| − | ===Deposition=== | + | ===Deposition Processes=== |
*[[Electron_beam_evaporation|E-beam evaporation]] | *[[Electron_beam_evaporation|E-beam evaporation]] | ||
*[[Sputter_deposition|Sputter deposition]] | *[[Sputter_deposition|Sputter deposition]] | ||
Revision as of 10:24, 8 April 2020
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Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.
Contents
Processing Equipment
Deposition Equipment
- Lab 18-2
- Enerjet Evaporator
- Cooke Evaporator
- SJ-20 Evaporator
- Angstrom Engineering Evovac Evaporator
Etching Equipment
Applications
- Conducting Layer
- Bond Pads
- Bonding material for Eutectic bonding or Thermal Compression bonding.
Processes
Deposition Processes
Etch Processes
- Wet etching
- Wet etching is done by using Transene Gold Etch 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]
