Difference between revisions of "Gold"

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**[[SJ-20 Evaporator]]
**[[SJ-20 Evaporator]]
**[[SJ-26 Evaporator]]
**[[SJ-26 Evaporator]]
**[[Angstrom Engineering Evovac Evaporator]]
**[[Acid Bench 12]]
**[[Acid Bench 12]]

Revision as of 08:42, 29 June 2016

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Material Details
Material Restriction Metals

Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.


Discuss common uses/applications for this material.

Processing Tools

Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.


  • List of equipment for processing this material


  • List of chemical (or otherwise) processes for this material