Difference between revisions of "Gold"
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| Line 29: | Line 29: | ||
*Etching | *Etching | ||
**[[Acid Bench 12]] | **[[Acid Bench 12]] | ||
| + | **[[Acid Bench 73]] | ||
| + | **[[Acid Bench 82]] | ||
**[[Plasmatherm 790]] | **[[Plasmatherm 790]] | ||
**[[STS Glass Etcher]] | **[[STS Glass Etcher]] | ||
Revision as of 18:49, 31 March 2020
 Warning: | This page has not been released yet. |
| Gold | |
|---|---|
| Material Details | |
| Material Restriction | Metals |
Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.
Applications
Discuss common uses/applications for this material.
Processing Tools
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
Equipment
- Deposition
- Etching
- List of equipment for processing this material
Processes
- Deposition
- List of chemical (or otherwise) processes for this material
