Difference between revisions of "Gold"
| Line 37: | Line 37: | ||
==Processes== | ==Processes== | ||
===Deposition=== | ===Deposition=== | ||
| − | + | *[[Electron_beam_evaporation|E-beam evaporation]] | |
| − | + | *[[Sputter_deposition|Sputter deposition]] | |
| − | + | *[[Gold Plating]] | |
| + | |||
===Etch Processes=== | ===Etch Processes=== | ||
====[[Wet etching]]==== | ====[[Wet etching]]==== | ||
Revision as of 09:26, 8 April 2020
 Warning: | This page has not been released yet. |
| Gold | |
|---|---|
| Material Details | |
| Material Restriction | Metals |
Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.
Contents
Applications
Discuss common uses/applications for this material.
Processing Tools
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
Deposition Equipment
- Lab 18-2
- Enerjet Evaporator
- Cooke Evaporator
- SJ-20 Evaporator
- Angstrom Engineering Evovac Evaporator
Etching Equipment
- List of equipment for processing this material
Processes
Deposition
Etch Processes
Wet etching
Wet etching is done by using Transene Gold Etch 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]
