Difference between revisions of "Gold"

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{{#vardefine:restriction|3}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies -->
 
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Gold is generally used for conductive layers and occasionally in bonding applications.  Due to its high mobility it is not allowed in most semiconductor equipment.
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Gold is generally used for conductive layers and occasionally in bonding applications.  Due to its high mobility it is not allowed in most semiconductor equipment. Gold is commonly refereed to by it's atomic symbol Au.
  
 
==Processing Equipment==
 
==Processing Equipment==

Latest revision as of 11:53, 8 April 2020

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Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment. Gold is commonly refereed to by it's atomic symbol Au.

Processing Equipment

Deposition Equipment

Etching Equipment

Applications

Processes

Deposition Processes

Etch Processes

  • Wet etching
    • Wet etching is done by using Transene Gold Etch 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]

References