|Warning:||This page has not been released yet.|
Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.
Discuss common uses/applications for this material.
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
- Acid Bench 12
- RIE tools?
- List of equipment for processing this material
- List of chemical (or otherwise) processes for this material