Open main menu
Warning Warning: This page has not been released yet.



Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.

Gold
Material Details
Material Restriction Metals


Contents

Applications

Discuss common uses/applications for this material.

Processing Tools

Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.

Equipment

  • List of equipment for processing this material

Processes

  • List of chemical (or otherwise) processes for this material

References