Gold

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Gold
Material Details
Material Restriction	Metals

Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.

Applications

Discuss common uses/applications for this material.

Processing Tools

Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.

Equipment

• Deposition
  • Lab 18-2
  • Enerjet Evaporator
  • Cooke Evaporator
  • SJ-20 Evaporator
  • SJ-26 Evaporator
  • Angstrom Engineering Evovac Evaporator
• Etching
  • Acid Bench 12
  • Acid Bench 73
  • Acid Bench 82
  • Plasmatherm 790
  • STS Glass Etcher

• List of equipment for processing this material

Processes

• Deposition
  • Evaporated Gold
  • Plated Gold
  • Sputtered Gold
• List of chemical (or otherwise) processes for this material

References

• Wikipedia Gold