Difference between revisions of "Gold Plating"

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{{infobox equipment
 
{{infobox equipment
 
|caption = Gold Plating Station
 
|caption = Gold Plating Station
|materials =  
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|materials = [[Gold]]
|mask =
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|mask = [[KMPR]], [[SU-8]], [[Photoresist|Positive Resist]]
|size =
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|size = 6" wafer to 1cm pieces
|chemicals =
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|chemicals = [[BDT 510-510 Makeup]], [[BDT Brightener]], [[Sodium Sulfate (Anhydrous)]]
 
|gases =  
 
|gases =  
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
+
|overview = [https://docs.google.com/document/d/1QoZO_y2GVH_qMRKsppvctoanl9TD5ZLtxAcB_lly-cE/preview System Overview]
|sop = [https://link.to.google.doc/preview SOP]
+
|sop = [https://docs.google.com/document/d/15Pj3HPhcWwJyMGTeR4yoJ9xqGKLDGRhCWyyj2sop8nU/preview SOP]
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
+
|processes = [[{{PAGENAME}}#Supported processes|Supported Processes]]
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
+
<!--|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]-->
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
}}
 
}}
  
{{warning|This page has not been released yet.}}
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[[{{PAGENAME}}]] is typically used for depositing thicker layers of [[gold]] onto the surface of the sample. The sample has a seed layer of [[gold]] or [[copper]], patterned [[photoresist]] and the gold is deposited into the exposed area. It is important that you know the amount of exposed area for the calculations required to use the tool.
 
 
<!-- Insert the tool description here -->
 
  
 
==Announcements==
 
==Announcements==
*Update this with announcements as necessary
 
  
 
==Capabilities==
 
==Capabilities==
 
<!--A more general description of what the tool is capable of doing.-->
 
<!--A more general description of what the tool is capable of doing.-->
* Plating rate (based on 2mA/cm<sup>2</sup> open area) 100nm/min
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* Plating rate (based on 2 mA/cm<sup>2</sup> open area) 100 nm/min
* Very small features and high aspect ratios may be limited by diffusion of ions into the feature
+
* Very small features and high aspect ratios may limit plating rate because of depletion of gold ions in the feature
* Aspect ratio is limited by photoresist
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* Aspect ratio is normally limited by photoresist
* Typical plating ranges from 0.1 to 20um. If you are plating thicker than 20um please contact a tool engineer.
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* Typical plating thickness ranges from 0.1 to 20 µm. If you are plating thicker than 20 µm please contact a tool engineer.
  
 
==System overview==
 
==System overview==
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* Glass tank
 
* Glass tank
 
* Wafter holder
 
* Wafter holder
* Electrode holder
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* Platinum Annode on teflon holder
 
* Hotplate with temperature probe
 
* Hotplate with temperature probe
 
* Filter and filter pump
 
* Filter and filter pump
 
* Programmable current source (DC)
 
* Programmable current source (DC)
 +
* Digital Volt Meter
  
 
===Substrate requirements===
 
===Substrate requirements===
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*Know the properties and hazards of chemicals you are working with.  If you don’t know, find out by reading about them or asking staff.
 
*Know the properties and hazards of chemicals you are working with.  If you don’t know, find out by reading about them or asking staff.
 
*Plan the details of your process. Before you start working, plan what quantities of chemicals and sample carriers you will use.  Plan how you will rinse your sample and what you will do with any waste generated.  Make sure you know how the controllers work.
 
*Plan the details of your process. Before you start working, plan what quantities of chemicals and sample carriers you will use.  Plan how you will rinse your sample and what you will do with any waste generated.  Make sure you know how the controllers work.
*Only process 4” and 6” wafers.
 
 
*Do not use this bench without proper training.
 
*Do not use this bench without proper training.
 
*Waste from this bench goes into the LNF’s acid waste neutralization system and then to city sewers.   
 
*Waste from this bench goes into the LNF’s acid waste neutralization system and then to city sewers.   
**No solvents can be used or disposed of here.
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**No gold plating solution can be used or disposed of here.
**Solutions which contains toxic materials that cannot be removed by neutralization (such as gold and chromium etch) should not be aspirated or disposed of down the drain.
 
 
 
  
 
===Material restrictions===
 
===Material restrictions===
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<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
  
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
+
The only process utilized on this tool is DC gold plating.
 +
For resists, we have found that
 +
*[[SPR 220]] is not a good plating resist.
 +
*[[AZ 12XT]] can be patterned in 5:1 aspect ratios, and negative resists such as [[KMPR]], and [[SU8]] make very good plating molds and can be patterned in very high aspect ratios, however they are very difficult to remove after plating.
 +
 
 +
Characterization:
 +
With a current of 2mA/cm<sup>2</sup> this process electroplates gold at a rate of 0.1 microns/min.
 +
The BDT-510 solution is a non-cyanide base process, but the additive contains arsenic.
 +
 
 +
{{warning|This page has not been released yet.}}
 +
 
 +
<!-- Insert the tool description here -->
  
 
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
 
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
 
  
 
==Standard operating procedure==
 
==Standard operating procedure==
 +
{{cleanup-manual|section=SOP}}
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=googledocid}}
+
{{#widget:GoogleDoc|key=15Pj3HPhcWwJyMGTeR4yoJ9xqGKLDGRhCWyyj2sop8nU}}
  
 
==Checkout procedure==
 
==Checkout procedure==
 
<!-- Describe the checkout procedure for the tool. For example: -->
 
<!-- Describe the checkout procedure for the tool. For example: -->
 
# Read through this page and the Standard Operating Procedure above.
 
# Read through this page and the Standard Operating Procedure above.
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
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# Train and practice with your mentor or another authorized user until you are comfortable with tool operation.
# A tool engineer will schedule a time for initial training.
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# If your mentor or another group member is not authorized open a help desk ticket requesting training.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
 
<!--# Complete the SOP quiz [http://examplelink.com here].-->
 
<!--# Complete the SOP quiz [http://examplelink.com here].-->
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
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==Maintenance==  
 
==Maintenance==  
 
<!-- Describe standard maintenance/qualification tests here -->
 
<!-- Describe standard maintenance/qualification tests here -->
* The solution is changed after 50A Hrs
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* Fillout online [https://docs.google.com/forms/d/e/1FAIpQLSdpo05xzQUfGIGTVqd3m1_qjeQnWb43GU-5-boU_2taKUoL1w/viewform logbook] to help everyone know solution status.
 +
* The solution test coupons are plating ever 10-15 Amp-min to check plating quality and rate.
 +
* If volts are over 1 V during plating, plating quality is assessed and bath is adjusted.
 +
* Brightener is added when the surface of the plated gold becomes rough
 +
* If you find issues with the plating, please create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket]
  
 +
{{#widget:Iframe
 +
|url=https://docs.google.com/spreadsheets/d/e/2PACX-1vRqZsT3eaV3JUp4lfP-1rcw4qiJjbEB2TE_LSeH2FAfPjH7oupkbHmaBx3IjyKIWO--0wKe7QZ-k5Ql/pubhtml?gid=986858532&single=true
 +
|width=920
 +
|height=400
 +
|border=0
 +
}}-->
  
===Process name===
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<!-- This is an example a chart published with etch data. You can just replace the url with your own.  
<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
 
 
{{#widget:Iframe
 
{{#widget:Iframe
|url=chart url
+
|url=https://docs.google.com/spreadsheets/d/1rg0yDZgGrNSIYLKrN9Qh7sKJtgV-1PpYcgMxQWod-Cs/edit?usp=sharing
 
|width=800
 
|width=800
 
|height=400
 
|height=400
 
|border=0
 
|border=0
}}
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}}-->

Latest revision as of 07:47, 24 June 2022

Gold Plating
170030.jpg
Gold Plating Station
Equipment Details
Technology Wet bench
Materials Restriction Metals
Material Processed Gold
Mask Materials KMPR, SU-8, Positive Resist
Sample Size 6" wafer to 1cm pieces
Chemicals Used BDT 510-510 Makeup, BDT Brightener, Sodium Sulfate (Anhydrous)
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance


Gold Plating is typically used for depositing thicker layers of gold onto the surface of the sample. The sample has a seed layer of gold or copper, patterned photoresist and the gold is deposited into the exposed area. It is important that you know the amount of exposed area for the calculations required to use the tool.

Announcements

Capabilities

  • Plating rate (based on 2 mA/cm2 open area) 100 nm/min
  • Very small features and high aspect ratios may limit plating rate because of depletion of gold ions in the feature
  • Aspect ratio is normally limited by photoresist
  • Typical plating thickness ranges from 0.1 to 20 µm. If you are plating thicker than 20 µm please contact a tool engineer.

System overview

Hardware details

  • BDT-510 makeup (plating solution itself)
  • BDT Brightener (an additive for improving surface finish)
  • Sodium Sulphate (anhydrous) CAS # 7757-82-6
  • Glass tank
  • Wafter holder
  • Platinum Annode on teflon holder
  • Hotplate with temperature probe
  • Filter and filter pump
  • Programmable current source (DC)
  • Digital Volt Meter

Substrate requirements

  • small pieces to 6" wafers
  • All substrates

Safety

Proper PPE for this bench are apron, face shield, trionic gloves and safety glasses
Warning Warning: You must use the buddy system for all chemical processing. No processing if you are alone in the lab. If the yellow warning lights are on it means that there are 2 or 1 people in the lab.

Working with chemicals can be very dangerous. Chemicals used at this bench are some of the most hazardous in the lab. To minimize the chance of accident, make sure you always:

  • Wear personal protective equipment. Required PPE at this bench is an apron, face shield, and Trionic gloves.
  • Know the properties and hazards of chemicals you are working with. If you don’t know, find out by reading about them or asking staff.
  • Plan the details of your process. Before you start working, plan what quantities of chemicals and sample carriers you will use. Plan how you will rinse your sample and what you will do with any waste generated. Make sure you know how the controllers work.
  • Do not use this bench without proper training.
  • Waste from this bench goes into the LNF’s acid waste neutralization system and then to city sewers.
    • No gold plating solution can be used or disposed of here.

Material restrictions

The Gold Plating is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

The only process utilized on this tool is DC gold plating. For resists, we have found that

  • SPR 220 is not a good plating resist.
  • AZ 12XT can be patterned in 5:1 aspect ratios, and negative resists such as KMPR, and SU8 make very good plating molds and can be patterned in very high aspect ratios, however they are very difficult to remove after plating.

Characterization: With a current of 2mA/cm2 this process electroplates gold at a rate of 0.1 microns/min. The BDT-510 solution is a non-cyanide base process, but the additive contains arsenic.

Warning Warning: This page has not been released yet.


Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Train and practice with your mentor or another authorized user until you are comfortable with tool operation.
  3. If your mentor or another group member is not authorized open a help desk ticket requesting training.
  4. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

  • Fillout online logbook to help everyone know solution status.
  • The solution test coupons are plating ever 10-15 Amp-min to check plating quality and rate.
  • If volts are over 1 V during plating, plating quality is assessed and bath is adjusted.
  • Brightener is added when the surface of the plated gold becomes rough
  • If you find issues with the plating, please create a helpdesk ticket

-->