Gold Plating
| Gold Plating | |
|---|---|
 Gold Plating Station | |
| Equipment Details | |
| Technology | Wet bench |
| Materials Restriction | Metals |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| User Processes | User Processes |
| Maintenance | Maintenance |
 Warning: | This page has not been released yet. |
Contents
Announcements
- Update this with announcements as necessary
Capabilities
- Plating rate (based on 2mA/cm2 open area) 100nm/min
- Very small features and high aspect ratios may be limited by diffusion of ions into the feature
- Aspect ratio is limited by photoresist
- Typical plating ranges from 0.1 to 20um. If you are plating thicker than 20um please contact a tool engineer.
System overview
Hardware details
- BDT-510 makeup (plating solution itself)
- BDT Brightener (an additive for improving surface finish)
- Sodium Sulphate (anhydrous) CAS # 7757-82-6
- Glass tank
- Wafter holder
- Electrode holder
- Hotplate with temperature probe
- Filter and filter pump
- Programmable current source (DC)
Substrate requirements
- small pieces to 6" wafers
- All substrates
Safety
| Warning: | You must use the buddy system for all chemical processing. No processing if you are alone in the lab. If the yellow warning lights are on it means that there are 2 or 1 people in the lab. |
Working with chemicals can be very dangerous. Chemicals used at this bench are some of the most hazardous in the lab. To minimize the chance of accident, make sure you always:
- Wear personal protective equipment. Required PPE at this bench is an apron, face shield, and Trionic gloves.
- Know the properties and hazards of chemicals you are working with. If you don’t know, find out by reading about them or asking staff.
- Plan the details of your process. Before you start working, plan what quantities of chemicals and sample carriers you will use. Plan how you will rinse your sample and what you will do with any waste generated. Make sure you know how the controllers work.
- Only process 4” and 6” wafers.
- Do not use this bench without proper training.
- Waste from this bench goes into the LNF’s acid waste neutralization system and then to city sewers.
- No solvents can be used or disposed of here.
- Solutions which contains toxic materials that cannot be removed by neutralization (such as gold and chromium etch) should not be aspirated or disposed of down the drain.
Material restrictions
The Gold Plating is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported processes
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Gold Plating user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
Widget text will go here.
Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Create a Helpdesk Ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Maintenance
- The solution is changed after 50A Hrs
Process name
