Difference between revisions of "June 2016 water damage"
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| Lab 18-1
| Lab 18-1
Revision as of 11:47, 7 June 2016
This page has been created to consolidate updates following the June 4th flood that occurred in EECS 1480 (new cleanroom space). Note that ROBIN and EECS 1440 (older part of the cleanroom) were not affected.
As of 6/4/16, all equipment in 1480 EECS is off-line and there is no user access to that area of the lab.
No access to EECS 1480 (newer part of cleanroom)
|Furnaces stacks 1, 2, 3, 4 and 5||Off-line|
|AlN sputtering tool||Off-line|
|Pegasus 4 and 6||Off-line|
|STS glass etcher||Off-line|
|JEOL e-beam lithography||Off-line|
|YES plasma stripper||Off-line|
|Pre furnace clean bench||Off-line|
|Acid 02 bench||Off-line|
|Acid 12 bench||Off-line||See alternative below|
|Mask 13 bench||Off-line||See alternative below|
|Solvent 14 bench||Off-line||See alternative below|
|EB spinner 21 bench||Off-line|
|EB solvent 22 bench||Off-line|
|Acid 23 bench||Off-line|
Alternative solutions and back up
Wafer mounting station
Wet benches (Acid 12, Mask 13, and Solvent 14)
Tanks were added in Acid 72 for:
- Cr Etch
- Gold Etch
These should be used instead of Acid 12 and Mask 13.
Solvent 84 should be used instead of Solvent 14. This bench should accommodate most of the processing.