Difference between revisions of "June 2016 water damage"

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===Wafer mounting station===
 
===Wafer mounting station===
The wafer mounting station has been relocated near the LAM RIE tool
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The wafer mounting station has been relocated near the LAM RIE tool. The wafer mounting station will be returned to its original location once 1480B is accessible to users.
  
 
===(MC)2 access for LNF users needing AFM===
 
===(MC)2 access for LNF users needing AFM===

Revision as of 07:25, 15 July 2016

This page has been created to consolidate updates following the June 4th flood that occurred in EECS 1480 (new cleanroom space). Note that ROBIN and EECS 1440 (older part of the cleanroom) were not affected. Please see below for updated status.

Facility status

The cleaning and certification is expected to be completed by July 15th. We expect the facility to re-open July 25th. Some equipment will be ready to be used, staff will be working in the equipment characterization in the after hours of the days the clean room is being certified in order to have the equipment that was not damaged by water ready to be used when the clean room reopens. Some equipment might still present damage and parts might be needed. We have tried to anticipate damage from visual inspections and order parts, but staff has not had access to all equipment therefore some may need parts. These will also need to be recharacterized after the repair is done. Some tools have sustained significant damage and may have a different timeline for coming back online (see below for more details).

In particular, the AFM has suffered irreparable damage and a new instruments has been ordered on 6/26/2016. The new instrument ordered is a Bruker Icon AFM [1]

Equipment status

Equipment Status Alternatives Comments
Furnaces stacks 1, 2, 3, 4 and 5 Off-line Alternatives available at Cornell. See below for more details and contact Pilar if you are interested. Once the facility reopens, maintenance, and re-characterization will be needed for each tube.
P5000 PECVD Off-line Alternatives for 4" processing of oxide and nitride is the GSI and for a-Si the Plasmatherm. Please be aware of broad range of materials allowed in the Plasmatherm and possible tool segregation issues for your process flow. For 6" processing, please submit a Helpdesk ticket and we will attempt to identify another facility for remote processing. Pneumatic Control Board and Heat Exchanger have been replaced. RF power supplies and lamps have been tested and plasma clean recipes have been run to exercise RF matching units. Next steps: chamber wet cleans (once lab cleaning is finished) and film characterization runs.

We expect the P5000 PECVD to be available for processing when facility opens.

Lab 18-1 Off-line Create a ticket or email info@LNF.umich.edu with details of films/thicknesses We expect the Lab 18-1 to be available for processing when facility opens.
Lab 18-2 Off-line Create a ticket or email info@LNF.umich.edu with details of films/thicknesses. Metal depositions have been moved to the Denton explorer. Targets available in the Denton Explorer-14: Pt, Ir, Au, Ti, Cr, W, WTi, soon Al and doped-Si. Up to date information will be included in the Denton Explorer Processes wiki page. We expect the Lab 18-2 to be available for processing when facility opens.
AlN sputtering tool Off-line We have not had opportunity to examine this tool Expect some delay releasing the ALN Sputtering tool
PDS 2035 Online
AFM Off-line (MC)2 - see details below Irreparable tool damage, replacement tool has been ordered
SEM Online
Pegasus 4 and 6 Off-line Staff expect to be able to operate the Pegasus 6 beginning 7/14. If you have an urgent need for DRIE before July 25th, please complete this form and staff will arrange with you to process your samples.
The Pegasus 4 is damaged and is waiting for replacement parts. Further updates will follow. Processing may be performed on the Pegasus 6 as mentioned above
We expect the Peg 4 and 6 to be available for processing when facility opens.
STS glass etcher Off-line Staff expect to be able to operate the glass etcher beginning 7/14. If you have an urgent need for processing, please create a helpdesk ticket and staff will arrange with you to process your samples. We expect the STS glass etcher to be available for processing when facility opens.
P5000 RIE Off-line Staff expect to be able to operate the P5000 beginning 7/14. If you have an urgent need for processing, please create a helpdesk ticket and staff will arrange with you to process your samples. We expect the P5000 RIE to be available for processing when facility opens.
JEOL e-beam lithography Online
YES plasma stripper Online
Pre furnace clean bench Off-line Working-needs cleaning and testing We expect the PFC bench to be available for processing when facility opens.
Acid 02 bench Off-line Working-needs cleaning and testing We expect the Acid 02 bench to be available for processing when facility opens.
Acid 12 bench Off-line See alternative below Working-should be online when 1480B re-opens
Mask 13 bench Off-line See alternative below Working-should be online when 1480B re-opens
Solvent 14 bench Off-line See alternative below Working-should be online when 1480B re-opens
EB spinner 21 bench Online
EB solvent 22 bench Online
Acid 23 bench Off-line
6" SRD 1480 Off line SRD in 1440A is now 6"

Alternative solutions and back up

Wafer mounting station

The wafer mounting station has been relocated near the LAM RIE tool. The wafer mounting station will be returned to its original location once 1480B is accessible to users.

(MC)2 access for LNF users needing AFM

Furnace processing at Cornell University

  • Wet and dry Thermal Oxidation up to 1200 C
  • Ar, N2 and 5%H2 forming gas anneals 200-1100C
  • POCL3 Doping furnace for 4 and 6” wafers
  • Solid Planar Diffusion Sources of Boron and Phosphorus for 4” wafers only
  • LPCVD LTO 450 C Silane/O2
  • LPCVD Polysilicon, undoped, N+ or P+ in-situ Doped
  • LPCVD Silicon nitride — Stoichiometric, Low Stress, Hight Temp Oxide 800C

Wet benches (Acid 12, Mask 13, and Solvent 14)

Tanks were added in Acid 72 for:

  • Cr Etch
  • Gold Etch
  • Nanostrip
  • BHF

These should be used instead of Acid 12 and Mask 13.

Solvent 84 should be used instead of Solvent 14. This bench should accommodate most of the processing.


E-Beam Spinner/Hot-Plate Bench 21

Users can use the CEE 100CB spinner in 1440C to spin PMMA. 950K A2, 950K A4, and 950K A6 PMMA are available in amber bottles in the Akro bin near the top right corner of the bench.

Please create a helpdesk ticket if you don't have access to this spinner. If you are already checked out, please follow protocol particular to this bench.

You can also use the hotplates that are in 1440C for baking.

YES Plasma Stripper

A comparable O2 descum recipe has been developed on the Plasmatherm 790.

Metal Sputtering Deposition

The Denton Explorer-14 Sputter has been equipped with: Ir, Au,Pt, Cr, Ti, W, WTi. This week both Al and doped-Si sputtering deposition will be characterized.

Please write a ticket if you need training in this tool.

The Denton can't do co-sputtering or reactive sputtering. No magnetic, paramagnetic or insulating materials either

1480 6" SRD

The SRD in 1440A can do 6" wafers