June 2016 water damage
This page has been created to consolidate updates following the June 4th flood that occurred in EECS 1480 (new cleanroom space). Note that ROBIN and EECS 1440 (older part of the cleanroom) were not affected.
As of 6/4/16, all equipment in 1480 EECS is off-line and there is no user access to that area of the lab.
- 1 Facility status
- 2 Equipment status
- 3 Alternative solutions and back up
No access to EECS 1480 (newer part of cleanroom)
|Furnaces stacks 1, 2, 3, 4 and 5||Off-line||Alternatives available at Cornell. See below for more details and contact Pilar if you are interested.|
|P5000 PECVD||Off-line||Pneumatic Control Board has been replaced. Heat exchanger won't flow and will need to be addressed before tool can be evaluated further.|
|Lab 18-1||Off-line||Create a ticket or email info@LNF.umich.edu with details of films/thicknesses|
|Lab 18-2||Off-line||Create a ticket or email info@LNF.umich.edu with details of films/thicknesses||Ti/Au, Cr/Au will be available in the Denton Explorer-14. Next target change will be on Wednesday 6/15, target in the tool: Ti/Au|
|AlN sputtering tool||Off-line|
|PDS 2035||On-line||Accessible starting June 15, 2016|
|AFM||Off-line||(MC)2 - see details below||Significant tool damage|
|SEM||On-line||(MC)2 - see details below||Expected to be back online the week of June 13, 2016|
|Pegasus 4 and 6||Off-line|
|STS glass etcher||Off-line|
|JEOL e-beam lithography||Off-line||Expected to be back online the week of June 13, 2016|
|YES plasma stripper||On-line||Re-opens June 15, 2016|
|Pre furnace clean bench||Off-line||Working-needs cleaning and testing. Will come online shortly after 1480C opens.|
|Acid 02 bench||Off-line||Working-needs cleaning and testing. Will come online shortly after 1480C opens.|
|Acid 12 bench||Off-line||See alternative below||Working-should be online when 1480B re-opens|
|Mask 13 bench||Off-line||See alternative below||Working-should be online when 1480B re-opens|
|Solvent 14 bench||Off-line||See alternative below||Working-should be online when 1480B re-opens|
|EB spinner 21 bench||On-line||See alternative below||1480A re-opens June 15, 2016|
|EB solvent 22 bench||On-line||1480A re-opens June 15|
|Acid 23 bench||Off-line|
Alternative solutions and back up
Wafer mounting station
The wafer mounting station has been relocated near the LAM RIE tool
(MC)2 access for LNF users needing AFM/SEM
- register to create an account in FOM
- Email Bobby Kerns, the (MC)2 center manager
- Bobby Kerns will arrange group training sessions on the AFM and training on the appropriate SEM as needed
- Complete the MCard form for direct access to the NCRC building 22
Furnace processing at Cornell University
- Wet and dry Thermal Oxidation up to 1200 C
- Ar, N2 and 5%H2 forming gas anneals 200-1100C
- POCL3 Doping furnace for 4 and 6” wafers
- Solid Planar Diffusion Sources of Boron and Phosphorus for 4” wafers only
- LPCVD LTO 450 C Silane/O2
- LPCVD Polysilicon, undoped, N+ or P+ in-situ Doped
- LPCVD Silicon nitride — Stoichiometric, Low Stress, Hight Temp Oxide 800C
Wet benches (Acid 12, Mask 13, and Solvent 14)
Tanks were added in Acid 72 for:
- Cr Etch
- Gold Etch
These should be used instead of Acid 12 and Mask 13.
Solvent 84 should be used instead of Solvent 14. This bench should accommodate most of the processing.
E-Beam Spinner/Hot-Plate Bench 21
Users can use the CEE 100CB spinner in 1440C to spin PMMA. 950K A2, 950K A4, and 950K A6 PMMA are available in amber bottles in the Akro bin near the top right corner of the bench.
Please create a helpdesk ticket if you don't have access to this spinner. If you are already checked out, please follow protocol particular to this bench.
You can also use the hotplates that are in 1440C for baking.
YES Plasma Stripper
A comparable O2 descum recipe has been developed on the Plasmatherm 790.
Ti/Au and Ti/Pt Sputtering Deposition
The Denton Explorer-14 Sputter has been equipped with both Au and Pt targets for sputtering using Ti as the bonding layer. Please write a ticket if you need training in this tool.