June 2016 water damage
This page has been created to consolidate updates following the June 4th flood that occurred in EECS 1480 (new cleanroom space). Note that ROBIN and EECS 1440 (older part of the cleanroom) were not affected. Please see below for updated status.
- 1 Facility status
- 2 Equipment status
- 3 Alternative solutions and back up
Access has been reopened for EECS 1480A (e-beam / SEM bay) and the service aisle that provides access to the parylene deposition tool. As the facility cleaning progresses, access to that space will be done via the service aisle, escorted by staff, and so will only be available 6am-6pm weekdays. Updates will be provided tool by tool via email. The rest of the 1480 space is still closed while cleaning continues. The cleaning is expected to be completed by July 15th, and the cleanroom certification is scheduled the week of July 18th. We expect the facility to re-open July 25th. Please note that some equipment may need to be recharacterized after the cleanroom certification is complete and may not be available immediately, and that some tools have sustained significant damage and may have a different timeline for coming back online (see below for more details).
|Furnaces stacks 1, 2, 3, 4 and 5||Off-line||Alternatives available at Cornell. See below for more details and contact Pilar if you are interested.||Once the facility reopens, maintenance, and re-characterization will be needed for each tube.|
|P5000 PECVD||Off-line||Alternatives for 4" processing of oxide and nitride is the GSI and for a-Si the Plasmatherm. Please be aware of broad range of materials allowed in the Plasmatherm and possible tool segregation issues for your process flow. For 6" processing, please submit a Helpdesk ticket and we will attempt to identify another facility for remote processing.||Pneumatic Control Board and Heat Exchanger have been replaced. RF power supplies and lamps have been tested and plasma clean recipes have been run to exercise RF matching units. Next steps: chamber wet cleans (once lab cleaning is finished) and film characterization runs.|
|Lab 18-1||Off-line||Create a ticket or email info@LNF.umich.edu with details of films/thicknesses|
|Lab 18-2||Off-line||Create a ticket or email info@LNF.umich.edu with details of films/thicknesses. Metal depositions have been moved to the Denton explorer. Targets available in the Denton Explorer-14: Pt, Ir, Au, Ti, Cr, W, WTi, soon Al and doped-Si. Up to date information will be included in the Denton Explorer Processes wiki page.|
|AlN sputtering tool||Off-line|
|AFM||Off-line||(MC)2 - see details below||Irreparable tool damage, replacement tool being ordered|
|Pegasus 4 and 6||Off-line|
|STS glass etcher||Off-line|
|JEOL e-beam lithography||Online|
|YES plasma stripper||Online|
|Pre furnace clean bench||Off-line||Working-needs cleaning and testing. Will come online shortly after 1480C opens.|
|Acid 02 bench||Off-line||Working-needs cleaning and testing. Will come online shortly after 1480C opens.|
|Acid 12 bench||Off-line||See alternative below||Working-should be online when 1480B re-opens|
|Mask 13 bench||Off-line||See alternative below||Working-should be online when 1480B re-opens|
|Solvent 14 bench||Off-line||See alternative below||Working-should be online when 1480B re-opens|
|EB spinner 21 bench||Online|
|EB solvent 22 bench||Online|
|Acid 23 bench||Off-line|
|6" SRD 1480||Off line||SRD in 1440A is now 6"|
Alternative solutions and back up
Wafer mounting station
The wafer mounting station has been relocated near the LAM RIE tool
(MC)2 access for LNF users needing AFM
- register to create an account in FOM
- Email Bobby Kerns, the (MC)2 center manager
- Bobby Kerns will arrange group training sessions on the AFM
- Complete the MCard form for direct access to the NCRC building 22
Furnace processing at Cornell University
- Wet and dry Thermal Oxidation up to 1200 C
- Ar, N2 and 5%H2 forming gas anneals 200-1100C
- POCL3 Doping furnace for 4 and 6” wafers
- Solid Planar Diffusion Sources of Boron and Phosphorus for 4” wafers only
- LPCVD LTO 450 C Silane/O2
- LPCVD Polysilicon, undoped, N+ or P+ in-situ Doped
- LPCVD Silicon nitride — Stoichiometric, Low Stress, Hight Temp Oxide 800C
Wet benches (Acid 12, Mask 13, and Solvent 14)
Tanks were added in Acid 72 for:
- Cr Etch
- Gold Etch
These should be used instead of Acid 12 and Mask 13.
Solvent 84 should be used instead of Solvent 14. This bench should accommodate most of the processing.
E-Beam Spinner/Hot-Plate Bench 21
Users can use the CEE 100CB spinner in 1440C to spin PMMA. 950K A2, 950K A4, and 950K A6 PMMA are available in amber bottles in the Akro bin near the top right corner of the bench.
Please create a helpdesk ticket if you don't have access to this spinner. If you are already checked out, please follow protocol particular to this bench.
You can also use the hotplates that are in 1440C for baking.
YES Plasma Stripper
A comparable O2 descum recipe has been developed on the Plasmatherm 790.
Metal Sputtering Deposition
The Denton Explorer-14 Sputter has been equipped with: Ir, Au,Pt, Cr, Ti, W, WTi. This week both Al and doped-Si sputtering deposition will be characterized.
Please write a ticket if you need training in this tool.
The Denton can't do co-sputtering or reactive sputtering. No magnetic, paramagnetic or insulating materials either
1480 6" SRD
The SRD in 1440A can do 6" wafers