KMPR is an i-line epoxy based photoresist that can be developed in TMAH based developers. It comes in a variety of viscosity and can coat 4-120um thick layers in a single spin. KMPR 1010 can be used to create layers 10-20um thick, and KMPR 1025 can create layers 20-65um thick.
10µm KMPR 1010 Process
We recommend reading through the full datasheet and following their recommendations.
- Spin in the CEE Apogee @ 3krpm
- Soft bake 100°C for 5 min
- Contact Aligners: 18 sec
- Bake at 100°C for 2 min
- CEE Puddle Developers: 60-60-60 TP
Soaking the sample in Remover PG at 80°C for 10-20min will swell the film and help it delaminate from the substrate. There is also a recipe on the YES that can be used, but