View source for LAM 9400

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{{infobox equipment
|caption= LAM 9400 SE
|materials = [[Silicon|Si]], [[Silicon dioxide|SiO<sub>2</sub>]], [[Silicon nitride|Si<sub>3</sub>N<sub>4</sub>]], 
Polymers, Reactive Metals
|mask = [[Photoresist|PR]], [[Silicon dioxide|SiO<sub>2</sub>]]
|size = 150 mm
|gases = [[Argon|Ar]], [[Boron_trichloride|BCl<sub>3</sub>]], [[Octafluorocyclobutane|C<sub>4</sub>F<sub>8</sub>]], [[Chlorine|Cl<sub>2</sub>]], 
[[Helium|He]], [[Hydrogen_bromide|HBr]], [[Oxygen|O<sub>2</sub>]], [[Sulfur_hexafluoride|SF<sub>6</sub>]]
|overview = [https://docs.google.com/a/lnf.umich.edu/document/d/1m2TXtJudsh-R00b4V0L_GGSbGWgfdPigrYjwAo9cINM/preview System Overview]
|sop = [https://drive.google.com/file/d/0B3k-qgz56T_4Nl9sMUlwbWVsSWc/view?usp=sharing&resourcekey=0-MfSBmBC7LBZGudhKY32hJA SOP]
|processes = [[LAM_9400/Processes|Supported Processes]]
|userprocesses = [[LNF_User:LAM_9400_User_Processes|User Processes]]
}}

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The LAM 9400 SE is a high density plasma etch tool manufactured by LAM Research Corporation. This tool was originally designed for production [[Polycrystalline_silicon|polysilicon]] etching, but has been reconfigured for [[Silicon|silicon]] based materials, III‐Vs, some metals, and organic materials.  It uses a TCP (transformer coupled plasma), which is a special patented form of an [[:Category:Reactive_ion_etching#Inductively_coupled|ICP]] source to enhance plasma density.  It also has a bias power supply for controlling ion bombardment energy. 



==Capabilities==
* Moderate etch rates ~1000-2000 Å/min
* Sub-micron features 1-2 µm deep 
* Large variety of [[Fluorine]] and [[Chlorine]] chemistries available
* Can process a wide range of materials such as polysilicon, oxide, nitride, III-V's, and some reactive metals.

==System Overview==
===Hardware Details===
*Gases
**[[Argon|Ar]] - 150 sccm
**[[Boron_trichloride|BCl<sub>3</sub>]] - 50 sccm
**[[Octafluorocyclobutane|C<sub>4</sub>F<sub>8</sub>]] - 100 sccm
**[[Chlorine|Cl<sub>2</sub>]] - 200 sccm
**[[Helium|He]] - 200 sccm
**[[Hydrogen_bromide|HBr]] - 200 sccm
**[[Oxygen|O<sub>2</sub>]] - 100 sccm
**[[Sulfur_hexafluoride|SF<sub>6</sub>]] - 100 sccm

*Pressure
** 1000 L/sec Seiko Seiki STP-H1000C turbo pump
** 2-100 mTorr
** Series 64 VAT valve

*Electrostatic Chuck
** 150 mm wafer
** 0-50 Torr backside [[Helium |He]] cooling
** 50°C Standard Temp (-40°C to 80°C Range)
** 750 V bipolar

*Chamber
** 50°C walls
** Anodized aluminum walls

* RF
** 1250 W 13.56 Mhz TPC - (600 W Max w/ bias, 800 W Max no bias)
** 1250 W 13.56 Mhz Bias - (200 W Max)

===Substrate Requirements===
* 150 mm wafers
** 100 mm wafers and pieces can be mounted to a plain [[Si]] carrier wafer with the [[Wafer Mounting Table]]
* 1 major flat required, minor flats are allowed
* 3 mm max height

===Material Restrictions===
{{material restrictions}}

==Supported Processes== 
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{{main|{{BASEPAGENAME}}/Processes}}

There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

==Standard Operating Procedure==
[https://drive.google.com/file/d/0B3k-qgz56T_4Nl9sMUlwbWVsSWc/view?usp=sharing&resourcekey=0-MfSBmBC7LBZGudhKY32hJA LAM 9400 SOP]

==Checkout Procedure==

# Complete the [[Sample_mounting#Training_modules|sample mounting course]].  If you have already completed this for another tool, you do not need to complete it again.
# Read through the [https://drive.google.com/file/d/0B3k-qgz56T_4Nl9sMUlwbWVsSWc/view?usp=sharing&resourcekey=0-MfSBmBC7LBZGudhKY32hJA User Manual] above.
# Accurately complete the [https://docs.google.com/a/lnf.umich.edu/forms/d/e/1FAIpQLScrDq1XoTkShsaccpIoiQpRBYg6da0uwkpspA9SCOLc7N03fg/viewform SOP quiz]. You may retake as necessary until all answers are correct.
# Complete the [https://docs.google.com/forms/d/e/1FAIpQLSf4FcYP1XIoE-scXpXtmaegIzceSVe3uaR8e9P3K3LQAvn20w/viewform process request form].
# Schedule a time for an initial training session:
## Find an available time [https://calendly.com/lnf-plasma-etch/lam-9400 here].
## Verify that the tool is available in the [https://ssel-sched.eecs.umich.edu/sselscheduler/ResourceDayWeek.aspx?Path=0-0-0-{{#var:toolid}} LNF Online Services] at the time you are requesting.
## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
## Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] for final confirmation of your appointment.
# Schedule a time for a checkout using the above procedure.
# Authorization will be provided pending successful completion of the quiz and demonstration of proper tool use in the presence of a tool engineer.

==Qualification==
As part of the maintenance performed on the LAM 9400, the LNF Poly recipe is run on a 6" Si wafer routinely to ensure the systems stability (~22% open area, SPR mask, 10 sec BT, 300sec ME).

{{#widget:Iframe
|url=https://docs.google.com/spreadsheets/d/e/2PACX-1vT_dzCrdFEbQ_4XcGV5sruQtnbyZ8a1Xl0xO7_vxSsRVnTurErfQtcLft5BLqTYBCA8x_tNvOt-e5Hv/pubchart?oid=1132409377&format=interactive
|width=800
|height=400
|border=0
}}