LAM 9400
LAM 9400 | |
---|---|
LAM 9400 SE | |
Equipment Details | |
Technology | RIE |
Materials Restriction | Semi-Clean |
Material Processed | Polymers, Reactive Metals |
Mask Materials | PR, SiO2 |
Sample Size | 150 mm |
Gases Used | He, HBr, O2, SF6 |
Equipment Manual | |
Overview | System Overview |
Operating Procedure | SOP |
Supported Processes | Supported Processes |
User Processes | User Processes |
The LAM 9400 SE is a high density plasma etch tool manufactured by LAM Research Corporation. This tool was originally designed for production polysilicon etching, but has been reconfigured for silicon based materials, III‐Vs, some metals, and organic materials. It uses a TCP (transformer coupled plasma), which is a special patented form of an ICP source to enhance plasma density. It also has a bias power supply for controlling ion bombardment energy.
Contents
Capabilities
- Moderate etch rates ~1000-2000 Å/min
- Sub-micron features 1-2 µm deep
- Large variety of Fluorine and Chlorine chemistries available
- Can process a wide range of materials such as polysilicon, oxide, nitride, III-V's, and some reactive metals.
System Overview
Hardware Details
- Gases
- Pressure
- 1000 L/sec Seiko Seiki STP-H1000C turbo pump
- 2-100 mTorr
- Series 64 VAT valve
- Electrostatic Chuck
- 150 mm wafer
- 0-50 Torr backside He cooling
- 50°C Standard Temp (-40°C to 80°C Range)
- 750 V bipolar
- Chamber
- 50°C walls
- Anodized aluminum walls
- RF
- 1250 W 13.56 Mhz TPC - (600 W Max w/ bias, 800 W Max no bias)
- 1250 W 13.56 Mhz Bias - (200 W Max)
Substrate Requirements
- 150 mm wafers
- 100 mm wafers and pieces can be mounted to a plain Si carrier wafer with the Wafer Mounting Table
- 1 major flat
- 3 mm max height
Material Restrictions
The LAM 9400 is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported Processes
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on LAM 9400 User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard Operating Procedure
Checkout Procedure
- Complete the sample mounting course. If you have already completed this for another tool, you do not need to complete it again.
- Read through the User Manual above.
- Accurately complete the SOP quiz. You may retake as necessary until all answers are correct.
- Complete the process request form.
- Schedule a time for an initial training session:
- Find an available time here.
- Verify that the tool is available in the LNF Online Services at the time you are requesting.
- After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
- Create a helpdesk ticket for final confirmation of your appointment.
- Schedule a time for a checkout using the above procedure.
- Authorization will be provided pending successful completion of the quiz and demonstration of proper tool use in the presence of a tool engineer.
Qualification
As part of the maintenance performed on the LAM 9400, the LNF Poly recipe is run on a 6" Si wafer routinely to ensure the systems stability (~22% open area, SPR mask, 10 sec BT, 300sec ME).