Difference between revisions of "LAM 9400/Processes"
< LAM 9400
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*[[{{PAGENAME}}/LNF_Ti_thin]] | *[[{{PAGENAME}}/LNF_Ti_thin]] | ||
*[[{{PAGENAME}}/LNF_Aluminum]] | *[[{{PAGENAME}}/LNF_Aluminum]] | ||
| + | *[[{{PAGENAME}}/LNF_Al2O3]] | ||
*[[{{PAGENAME}}/LNF_TiN_sel_Al2O3]] | *[[{{PAGENAME}}/LNF_TiN_sel_Al2O3]] | ||
Revision as of 13:44, 15 December 2020
The LAM 9400 has a variety of processes available. There are standard supported recipes for poly, oxide and nitride, although there are many more materials etched via user created recipes.
Proccess List
- LAM 9400/Processes/mnf_oxide1
- A SiO2 etch
- LAM 9400/Processes/mnf_oxynite2
- A etch designed to etch oxide and nitride at similar rates
- LAM 9400/Processes/mnf_nitride1
- An etch designed to be selective to oxide
- LAM 9400/Processes/LNF_Poly
- An etch designed for polysilicon
- LAM 9400/Processes/LNF_Ti_thin
- LAM 9400/Processes/LNF_Aluminum
- LAM 9400/Processes/LNF_Al2O3
- LAM 9400/Processes/LNF_TiN_sel_Al2O3
