Difference between revisions of "LAM 9400/Processes/LNF Poly"
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LNF_Poly is designed for etching si and polysilicon in the LAM 9400. This recipe is currently under development and will replace poly_etch_2 as it does not have the same stability problems. | LNF_Poly is designed for etching si and polysilicon in the LAM 9400. This recipe is currently under development and will replace poly_etch_2 as it does not have the same stability problems. | ||
| + | ==Etch Rates== | ||
| + | *Si - 2800 Å/min | ||
| + | *SPR 220 (3.0) - 275 Å/min | ||
| + | *SiO<sub>2</sub> - 150 Å/min | ||
| + | {{#widget:Iframe | ||
| + | |url=https://docs.google.com/spreadsheets/d/1fMQ3FPo6sf2o-e0B2FYGRTN6iBklOu8UjS5TBbYDg70/pubchart?oid=1633184043&format=interactive | ||
| + | |width=600 | ||
| + | |height=400 | ||
| + | |border=0 | ||
| + | } | ||
==Parameters== | ==Parameters== | ||
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| − | + | ==Sidewall Profile== | |
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[[File:LAM_9400_LNF_Poly_2um_grating.jpg|400px]] | [[File:LAM_9400_LNF_Poly_2um_grating.jpg|400px]] | ||
==Limitations== | ==Limitations== | ||
Revision as of 11:43, 8 February 2016
| About this Process | |
|---|---|
| Process Details | |
| Equipment | LAM 9400 |
| Technology | RIE |
| Material | Poly |
| Mask Materials | PR |
| Gases Used | HBr, He |
| Date Created | 2016 |
LNF_Poly is designed for etching si and polysilicon in the LAM 9400. This recipe is currently under development and will replace poly_etch_2 as it does not have the same stability problems.
Etch Rates
- Si - 2800 Å/min
- SPR 220 (3.0) - 275 Å/min
- SiO2 - 150 Å/min
{{#widget:Iframe |url=https://docs.google.com/spreadsheets/d/1fMQ3FPo6sf2o-e0B2FYGRTN6iBklOu8UjS5TBbYDg70/pubchart?oid=1633184043&format=interactive |width=600 |height=400 |border=0 }
Parameters
| Parameter | Breakthrough | Main Etch |
|---|---|---|
| Time | 10 sec | variable |
| Pressure | 5 mTorr | 30 mTorr |
| TCP Power | 300 W | 600 W |
| Bias Power | 100 W | 90 W |
| Cl2 Flow | 60 sccm | 0 sccm |
| HBr Flow | 0 sccm | 100 sccm |
| He Flow | 0 sccm | 100 sccm |
Sidewall Profile
