LNF Sputter Adding New Films

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The LNF sputter systems have three access categories, user, technicians, and superuser. User level access allows access to the standard recipes where as technicians and superuser advanced access, such as changing targets, and modifying recipe conditions (variable parameter recipe).

Requesting new materials

The functionality of this program is to help aid in research by promoting a stable set of variables allowed in the PVD systems.

  • Create a request using the New Sputter Material Request Form.
  • Create a helpdesk ticket to inform LNF staff of your request, and to provide them with a forum to communicate with you.
  • Your request will be reviewed by the LNF management and staff.


See the Requesting a new material tutorial for specifics.

Source Requirements

Private and Co-Sputtering at the LNF

Sputter Targets Technical Notes

Ultra-High Purity Materials

In order to support this high standard of process dependability we require that all sources used in the sputter systems be low in impurities. Purity set related terms used in the metals market is, “nines”. In the case for LNF we require materials to have a purity value of 99.995% or greater. This is often described as, “Four Nines Five” and typically written as “4N5”. In cases where 4N5 materials are not available, contact a LNF staff to discuss your options.

TORUS® Circular HV (High Vacuum) Magnetron Sputtering Sources

TORUS® Magnetron Sputtering Sources

  • These sources are in the Lab 18's. Each material require a designated source shield for operation.
TORUS Source Model Target Diameter Thickness

(Non-Magnetic)

Thickness

(Ferromagnetic Materials)

TORUS 3

(Model TRS3 & TM03)

3" +/-0.020" 0.050"- 0.255" Fe: 0.08" Max (HSMA**)

Co: 0.125" Max (HSMA**) Ni: 0.125" (SMA***) or 0.250" Max (HSMA**)

TORUS® Mag Keeper™

Mag Keeper

  • These sources are in the PVD 75. Each material requires a designated source shield for operation.
  • Non-magnetic sources require a Target Keeper

Support

Due to issues of cross contamination, process development of co-sputtered films will require the purchase of private targets and shields.

Superuser access provides access to:

  • Target change
  • Modify and run VP (variable parameter) recipes
  • Create and support private recipes
  • Support and train colleagues
  • Custom film development
    1. Reactive sputtering
    2. Heated recipes (up to 350°C)
    3. Co-Sputtered films
    4. Applied bias voltages

Private Materials

  • All privately supported materials in the LNF are developer supported
    1. Storage, cleaning, burn-in, and recipe development is the responsibility of the owner
    2. The LNF in collaboration with OSEH can assist with the disposal of these materials

Private Shields

  • Each material requires a designated shield for processing.
    1. This is to prevent cross contamination, and provide a more reliable maintenance schedule
    2. Storage and cleaning is the responsibility of the developer.