Difference between revisions of "Lab 18-1"

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<!-- Set the resource ID, 5 digit # found on the scheduler --> <!-- Set the Process Technology (see subcategories on Equipment page) -->
 
<!-- Set the resource ID, 5 digit # found on the scheduler --> <!-- Set the Process Technology (see subcategories on Equipment page) -->
[[Sputter_deposition|< Sputter deposition]]
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[[Sputter_deposition|< Sputter deposition]]{{#vardefine:toolid|61071}} {{#vardefine:technology|PVD}} {{#vardefine:restriction|3}}
 
 
[[{{BASEPAGENAME}}/Processes]]
 
{{#vardefine:toolid|61071}} {{#vardefine:technology|PVD}} {{#vardefine:restriction|3}}
 
 
{{infobox equipment
 
{{infobox equipment
 
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
 
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
|materials = [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]], [[Indium-Tin-Oxide|ITO]], [[Molybdenum|Mo]], [[Silicon|Si]], [[Silicon Dioxide|SiO<sub>2</sub>]], [[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]], [[Tantalum|Ta]], [[Tantalum|Ta<sub>2</sub>O<sub>5</sub>]], [[Titanium|Ti]]
+
|materials = [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]], [[Indium-Tin-Oxide|ITO]], [[Molybdenum|Mo]], [[Silicon|Si]], [[Silicon dioxide|SiO<sub>2</sub>]], [[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]], [[Tantalum|Ta]], [[Tantalum|Ta<sub>2</sub>O<sub>5</sub>]], [[Titanium|Ti]], [[Vanadium|V]], [[Vanadium Pentoxide|V2O5]]
 
|mask =  
 
|mask =  
 
|size = 150mm x 4mm and smaller samples
 
|size = 150mm x 4mm and smaller samples
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|userprocesses = [[LNF_User:Lab_18-1_User_Processes|User Processes]]
 
|userprocesses = [[LNF_User:Lab_18-1_User_Processes|User Processes]]
 
}}
 
}}
Lab 18-1 is a magnetron sputter deposition tool for '''depositing less common metals, insulators, and semiconductive films.''' Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a DC power source, in which the target acts as the cathode in a diode system. [[Sputter_deposition|Sputtering]] of dielectrics such as [[Silicon_dioxide|silicon dioxide]], or aluminum oxide requires an RF power source to supply energy to the [[Argon|argon]] atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features.  
+
Lab 18-1 is a [[Sputter_deposition|sputter deposition]] tool used for the application of very thin films; 2-1000nm. This tool is set up to deposit oxides and metals including; ITO, Ti, Mo, Al and SiO2 among others.
  
 
==Announcements==
 
==Announcements==
*The target configuration has been moved to the Supported Process section below. Follow the link to [[Lab 18-1/Processes]]. On that page under the Target Calendar header is the link to the calendar.
 
  
*We have updated some of the recipe names in order to follow a more consistent naming scheme. For example "SiO2 reactive" was changed to "Si 1 RF Reactive Ox". The original name is not as expressive, and leads users wondering what the material actually is. In the case of "Si 1 RF Reactive Ox", it is understood that the recipe will inject O2 in a RF plasma field to attain a reactivity grown SiO2 film. Successors in the recipe name like; +Bias, +Heat, express extra conditions in the process recipe. For a complete list of changes to the recipes names see [https://docs.google.com/spreadsheets/d/1rxWYUCV6RWmlvUwev5Huk8M3zQcl3SL9TtoIyn0aUfs/edit#gid=1619664882|Lab 18-1 Recipe Set (current)].
+
*[https://docs.google.com/spreadsheets/d/1yMY0SG8PDlF4UWxz96uJVnmP9mcxYr0wGc1xmzmgF48/edit#gid=936976950| LNF Sputter Calendar]
  
 
==Capabilities==
 
==Capabilities==
* Computer controlled recipes  
+
 
* Load lock supported processing  
+
*Computer controlled recipes
* Limited film stress versatility with in film development.
+
*Load lock supported processing
* Reactive film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
+
*Limited film stress versatility with in film development.
 +
*Reactive film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
  
 
==Supported Processes==  
 
==Supported Processes==  
[[{{BASEPAGENAME}}/Processes]]
+
*[[{{BASEPAGENAME}}/Processes]]
 +
 
 
Basic "User" access to the Lab 18's provide researchers with the ability to load, transfer samples, and deposit standard characterized materials. For more details, see [[{{BASEPAGENAME}}/Processes]].
 
Basic "User" access to the Lab 18's provide researchers with the ability to load, transfer samples, and deposit standard characterized materials. For more details, see [[{{BASEPAGENAME}}/Processes]].
  
 
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on [[LNF_User:Lab_18-1_User_Processes|User Processes]].  
 
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on [[LNF_User:Lab_18-1_User_Processes|User Processes]].  
  
If you have a material deposition need that is not listed, check to see if this material is deposited on on another PVD tool or see more about options for running your own private material on the [[LNF PVD Films|LNF PVD Films]] page.  
+
If you have a material deposition need that is not listed, check to see if this material is deposited on on another PVD tool on the [[LNF PVD Films|LNF PVD Films]] page, or see more options for running your own private material on the [[{{BASEPAGENAME}}/Processes#Target_Calendar|Target configuration]] section of the {{BASEPAGENAME}}/Processes page. The PVD 75 Proline is the preferred sputtering tool for non-standard materials. See how to [http://lnf-wiki.eecs.umich.edu/wiki/LNF_PVD_Films#Requesting_to_Add_New_PVD_Materials Request New PVD Films] here. See more on how to request new sputter sources specifically on the [https://lnf-wiki.eecs.umich.edu/wiki/LNF_Sputter_Adding_New_Films LNF Sputter Adding New Films] page.
  
 
===Sputter Materials===
 
===Sputter Materials===
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<!-- I would like to make this a table-->
 
<!-- I would like to make this a table-->
  
Seven films are available.    If two thicknesses are listed the first is for per run and the second thickness is for total material used per reservation.
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Seven films are available.    If two thicknesses are listed the first is for per run and the second thickness is for total material used per reservation.  
  
 
{| class="wikitable" border="1"
 
{| class="wikitable" border="1"
 
|-
 
|-
! Material
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!Material
! Max thickness (Run/Reservation)  
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!Max thickness (Run/Reservation)
 
|-
 
|-
 
<!--| Aluminum ([[Aluminum|Al]])
 
<!--| Aluminum ([[Aluminum|Al]])
 
| 1 µm / NA
 
| 1 µm / NA
 
|--->
 
|--->
| Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])
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|Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])
| 100Å / NA
+
|100Å / NA
 
|-
 
|-
| Indium-Tin-Oxide ([[Indium-Tin-Oxide|ITO]])
+
|Indium-Tin-Oxide ([[Indium-Tin-Oxide|ITO]])
| 500 Å / 3000 Å
+
|500 Å / 3000 Å
 
|-
 
|-
| Molybdenum ([[Molybdenum|Mo]])
+
|Molybdenum ([[Molybdenum|Mo]])
| 3000 Å / 8000 Å
+
|3000 Å / 8000 Å
 
|-
 
|-
| Silicon (p-doped) ([[Silicon|Si]])
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|Silicon (p-doped) ([[Silicon|Si]])
| 3000 Å / 1 µm
+
|3000 Å / 1 µm
 
|-
 
|-
| Silicon Dioxide ([[Silicon Dioxide|SiO<sub>2</sub>]])
+
|Silicon dioxide ([[Silicon dioxide|SiO<sub>2</sub>]])
| 1000 Å / 3000 Å
+
|1000 Å / 3000 Å
 
|-
 
|-
| Silicon Nitride ([[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]])
+
|Silicon Nitride ([[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]])
| 500 Å / 2000 Å
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|500 Å / 2000 Å
 
|-
 
|-
| Tantalum ([[Tantalum|Ta]])
+
|Tantalum ([[Tantalum|Ta]])
| 3000 Å / 1 µm
+
|3000 Å / 1 µm
 
|-
 
|-
 
<!--| Tantalum Pentoxide([[Tantalum|Ta<sub>2</sub>O<sub>5</sub>]]])
 
<!--| Tantalum Pentoxide([[Tantalum|Ta<sub>2</sub>O<sub>5</sub>]]])
 
| 100 Å / NA
 
| 100 Å / NA
 
|--->
 
|--->
| Titanium ([[Titanium|Ti]])
+
|Titanium ([[Titanium|Ti]])
| 2000 Å / 6000 Å
+
|2000 Å / 6000 Å
 
|-
 
|-
<!--| Titanium Dioxide ([[Titanium Dioxide|TiO<sub>2</sub>]])
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<!--| Titanium Dioxide ([[Titanium dioxide|TiO<sub>2</sub>]])
 
| 2000 Å / NA
 
| 2000 Å / NA
 
|--->
 
|--->
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===Hardware Details===
 
===Hardware Details===
 +
 
*Turbo pumped chamber – upper 10<sup>-7</sup> Torr base pressure
 
*Turbo pumped chamber – upper 10<sup>-7</sup> Torr base pressure
 
*Chamber capacity: single wafer
 
*Chamber capacity: single wafer
 
*Configured with load lock
 
*Configured with load lock
*Sample heating – up to 500°C
+
*Sample heating – operable up to 450°C
* Power specs
+
*Power specs
 
**Five 3” Sputtering Guns
 
**Five 3” Sputtering Guns
 
**2 DC and 2 RF power supply (one for sample bias)
 
**2 DC and 2 RF power supply (one for sample bias)
  
 
===Substrate Requirements===
 
===Substrate Requirements===
 +
 
*Sample sizes: pieces, up to 6” wafers.
 
*Sample sizes: pieces, up to 6” wafers.
 
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
 
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
** Diameter 150 mm maximum
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**Diameter 150 mm maximum
** Substrates up to 4 mm thick, with special fixture up to 8 mm.
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**Substrates up to 4 mm thick, with special fixture up to 8 mm.
** [https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
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**[https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
  
 
===Material Restrictions===
 
===Material Restrictions===
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==Standard Operating Procedure==
 
==Standard Operating Procedure==
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=1JZafXTZbvQkeqPWAHTm_LTwAPXk7_8Su9Q-swt_I1xQ}}
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{{#widget:GoogleDoc|key=1R_uj2oR6XJHc4D-J8opSyOfX-Xjf9-9ZVN3Jsln4c_o}}
  
 
==Checkout Procedure==
 
==Checkout Procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
 
The Lab 18-1 is on the [[LNF Scheduler]]. LNF constituents may reserve time on the tool, and even request staff support for process development.
 
 
For more details, see [[KJLC Sputter Tool Access and Training]].
 
For more details, see [[KJLC Sputter Tool Access and Training]].
<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
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# Complete the online [https://rise.articulate.com/share/Ao7oMeRC8efjEeqElzqlBiPE6uyJ9y-T#/ PVD Rise Training] (this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)
# Read through the Standard Operating Procedure above.
+
# Read through this Wiki page and the Operating Procedure above.
 +
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training
 +
# A tool engineer or user services member will contact you for a training session.
 +
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
# Complete the [https://docs.google.com/forms/d/e/1FAIpQLSevGEsCoP5aNyADbDpt3_7tflfn_1mZNA-EM2lOOA0doqYbyw/viewform?embedded=true#start=embed| Lab 18 User Training Quiz]
 
# Complete the [https://docs.google.com/forms/d/e/1FAIpQLSevGEsCoP5aNyADbDpt3_7tflfn_1mZNA-EM2lOOA0doqYbyw/viewform?embedded=true#start=embed| Lab 18 User Training Quiz]
<!--# Complete the training request form [<link> here]. -->
+
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool at the "user" level.
# Create a  [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] requesting training.
+
 
# A tool engineer will schedule a time for initial training.
+
==Maintenance==
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
+
The sputter shield cleaning procedure is provided below. The source shields are stored on the rack between the Lab 18s when they are not installed. Some films that build up on the shield risk flaking off and shorting out plasma (W-Ti and ITO are the most frequent offenders).  This procedure mitigates that, so it is posted here to empower users.
<!--# Complete the SOP quiz [<link> here]. -->
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
  
<!--==Tool Qualification== -->
+
[https://docs.google.com/document/d/1TZFJKKvrBdjAQzsVgegt7mPrAVCy0OPCNOY276lf9vc/edit?usp=sharing| Lab 18 Shield Cleaning Procedure]
<!-- Describe standard maintenance/qualification tests here -->
 
  
==Maintenance==
 
 
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].
 
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].

Revision as of 14:01, 23 May 2022

< Sputter deposition

Lab 18-1
61071.jpg
Equipment Details
Technology PVD
Materials Restriction Metals
Material Processed Al2O3, ITO, Mo, Si, SiO2, Si3N4, Ta, Ta2O5, Ti, V, V2O5
Sample Size 150mm x 4mm and smaller samples
Gases Used Ar, N2, O2
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes


Lab 18-1 is a sputter deposition tool used for the application of very thin films; 2-1000nm. This tool is set up to deposit oxides and metals including; ITO, Ti, Mo, Al and SiO2 among others.

Announcements

Capabilities

  • Computer controlled recipes
  • Load lock supported processing
  • Limited film stress versatility with in film development.
  • Reactive film capabilities (Ar, O2, and N2)

Supported Processes

Basic "User" access to the Lab 18's provide researchers with the ability to load, transfer samples, and deposit standard characterized materials. For more details, see Lab 18-1/Processes.

In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes.

If you have a material deposition need that is not listed, check to see if this material is deposited on on another PVD tool on the LNF PVD Films page, or see more options for running your own private material on the Target configuration section of the Lab 18-1/Processes page. The PVD 75 Proline is the preferred sputtering tool for non-standard materials. See how to Request New PVD Films here. See more on how to request new sputter sources specifically on the LNF Sputter Adding New Films page.

Sputter Materials

Seven films are available. If two thicknesses are listed the first is for per run and the second thickness is for total material used per reservation.

Material Max thickness (Run/Reservation)
Alumina/Aluminum Oxide (Al2O3) 100Å / NA
Indium-Tin-Oxide (ITO) 500 Å / 3000 Å
Molybdenum (Mo) 3000 Å / 8000 Å
Silicon (p-doped) (Si) 3000 Å / 1 µm
Silicon dioxide (SiO2) 1000 Å / 3000 Å
Silicon Nitride (Si3N4) 500 Å / 2000 Å
Tantalum (Ta) 3000 Å / 1 µm
Titanium (Ti) 2000 Å / 6000 Å

System Overview

The Lab 18-1 has a 18" D-shaped chamber with a load lock chamber to quickly load and unload samples without breaking high vacuum in the process chamber. The tools five magnetron sputtering sources are set up to allow for RF, DC, and DC co-sputtering. There is an additional RF power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 500°C is achieved by using the tools quartz heater lamps.

Hardware Details

  • Turbo pumped chamber – upper 10-7 Torr base pressure
  • Chamber capacity: single wafer
  • Configured with load lock
  • Sample heating – operable up to 450°C
  • Power specs
    • Five 3” Sputtering Guns
    • 2 DC and 2 RF power supply (one for sample bias)

Substrate Requirements

  • Sample sizes: pieces, up to 6” wafers.
  • Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
    • Diameter 150 mm maximum
    • Substrates up to 4 mm thick, with special fixture up to 8 mm.
    • Sample Mounting

Material Restrictions

The Lab 18-1 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Standard Operating Procedure

Widget text will go here.

Checkout Procedure

For more details, see KJLC Sputter Tool Access and Training.

  1. Complete the online PVD Rise Training (this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)
  2. Read through this Wiki page and the Operating Procedure above.
  3. Create a Helpdesk Ticket requesting training
  4. A tool engineer or user services member will contact you for a training session.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the Lab 18 User Training Quiz
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool at the "user" level.

Maintenance

The sputter shield cleaning procedure is provided below. The source shields are stored on the rack between the Lab 18s when they are not installed. Some films that build up on the shield risk flaking off and shorting out plasma (W-Ti and ITO are the most frequent offenders). This procedure mitigates that, so it is posted here to empower users.

Lab 18 Shield Cleaning Procedure

For more details, see Lab 18-1/Maintenance and qualification.