Difference between revisions of "Lab 18-2"
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{{infobox equipment | {{infobox equipment | ||
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]] | |restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]] | ||
| − | |materials = [[Aluminum|Al]],[[Chromium|Cr]],[[Copper|Cu]],[[Gold|Au]],[[Germanium|Ge]],[[Iridium|Ir]],[[Nickel|Ni]],[[Nickel-Chromium|NiCr]],[[Platinum|Pt]],[[Silicon|Si]],[[Silver|Ag]],[[Titanium|Ti]] | + | |materials = [[Aluminum|Al]],[[Chromium|Cr]],[[Copper|Cu]],[[Gold|Au]],[[Germanium|Ge]],[[Iridium|Ir]],[[Nickel|Ni]],[[Nickel-Chromium|NiCr]],[[Platinum|Pt]],[[Silicon|Si]],[[Silver|Ag]],[[Titanium|Ti],[[Tungsten|W]] |
|mask = | |mask = | ||
|size = 150mm x 4mm and smaller samples | |size = 150mm x 4mm and smaller samples | ||
| Line 33: | Line 33: | ||
*Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure | *Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure | ||
*Chamber capacity: single wafer | *Chamber capacity: single wafer | ||
| − | *Configured with load lock | + | *Configured with a load lock |
*Sample heating – up to 500°C | *Sample heating – up to 500°C | ||
* Power specs | * Power specs | ||
| Line 50: | Line 50: | ||
==Supported Processes== | ==Supported Processes== | ||
| − | Basic "User" access with the Lab 18's provide researchers the ability to load, transfer samples, and deposit standard characterized materials. For more details, see [[{{BASEPAGENAME}}/Processes]]. | + | Basic "User" access with the Lab 18's provide researchers with the ability to load, transfer samples, and deposit standard characterized materials. For more details, see [[{{BASEPAGENAME}}/Processes]]. |
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes. Wondering if your material can be deposited in this tool, please contact the tool engineers via the helpdesk ticket system. See more about privately supported materials on the [[LNF_Sputter_Adding_New_Films|LNF Sputtering Adding New Films]] page. | In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes. Wondering if your material can be deposited in this tool, please contact the tool engineers via the helpdesk ticket system. See more about privately supported materials on the [[LNF_Sputter_Adding_New_Films|LNF Sputtering Adding New Films]] page. | ||
===Process Name=== | ===Process Name=== | ||
| − | <!-- This is an example a chart published with etch data. You can just replace the url with your own. --> | + | <!-- This is an example of a chart published with etch data. You can just replace the url with your own. --> |
<!-- I would like to make this a table--> | <!-- I would like to make this a table--> | ||
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==Checkout Procedure== | ==Checkout Procedure== | ||
The Lab 18-2 is on the [[LNF Scheduler]]. LNF constituents may reserve time on the tool, and even request staff support for process development. | The Lab 18-2 is on the [[LNF Scheduler]]. LNF constituents may reserve time on the tool, and even request staff support for process development. | ||
| − | <!-- This is an example a chart published with etch data. You can just replace the url with your own. --> | + | <!-- This is an example of a chart published with etch data. You can just replace the url with your own. --> |
| − | For more details LNF researchers can see [[Lab 18 access and training]] for the different access types. | + | For more details, LNF researchers can see [[Lab 18 access and training]] for the different access types. |
# Read through the Standard Operating Procedure above. | # Read through the Standard Operating Procedure above. | ||
<!--# Complete the training request form [<link> here]. --> | <!--# Complete the training request form [<link> here]. --> | ||
Revision as of 14:28, 22 March 2018
{{infobox equipment |restriction = Semi-Clean |materials = Al,Cr,Cu,Au,Ge,Ir,Ni,NiCr,Pt,Si,Ag,W |mask = |size = 150mm x 4mm and smaller samples |gases = Ar, N2, O2 |overview = |sop = |processes = |userprocesses = }} Lab 18-2 is a magnetron sputter deposition tool for depositing conductive metallic films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features.
Contents
Announcements
- The target configuration has been moved to the Supported Process section below. Follow the link to Lab 18-2/Processes. On that page under the Target Calendar header is the link to the calendar.
Capabilities
- Computer controlled recipes
- Load lock supported processing
- limited film stress versatility with in film development.
- Reactive Film capabilities (Ar, O2, and N2)
System Overview
The Lab 18-2 has a 18" D-shaped chamber with a load lock chamber to quickly load and unload samples without breaking high vacuum in the process chamber. The tools five magnetron sputtering sources are set up to allow for RF, DC, and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 500C is achieved by using the tools quartz heater lamps.
Hardware Details
- Cryo pumped chamber – upper 10-7 Torr base pressure
- Chamber capacity: single wafer
- Configured with a load lock
- Sample heating – up to 500°C
- Power specs
- Five 3” Sputtering Guns
- 2 DC and 2 RF power supply (one for sample bias)
Substrate Requirements
- Sample sizes: pieces, up to 6” wafers.
- Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
- Diameter 150 mm maximum
- Substrates up to 4 mm Thick. With special fixture up to 8 mm.
- Sample Mounting
Material Restrictions
The Lab 18-2 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported Processes
Basic "User" access with the Lab 18's provide researchers with the ability to load, transfer samples, and deposit standard characterized materials. For more details, see Lab 18-2/Processes.
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes. Wondering if your material can be deposited in this tool, please contact the tool engineers via the helpdesk ticket system. See more about privately supported materials on the LNF Sputtering Adding New Films page.
Process Name
Multiple staff characterized films are available. If two thicknesses are listed the first is for per run and the second thickness is for total material used per reservation.
| Material | Max thickness (Run/Reservation) | |
|---|---|---|
| Aluminum (Al) | 5000Å / NA | |
| Chrome (Cr) | 2000Å / NA | |
| Copper (Cu) | 1000Å / 5000Å | |
| Gold (Au) | 5000Å / NA | |
| Iron (Ir) | 1000Å / 5000Å | |
| Nickel (Ni) | 5000 Å / 1 µm | |
| Platinum (Pt) | 5000 Å / 1 µm | |
| Silver (Ag) | 5000 Å / 1 µm | |
| Titanium (Ti) | 2000 Å / 5000 Å | |
| Tungsten (W) | 3000 Å / 9000 Å | |
| Tungsten/Titanium (W-Ti) | 3000 Å / 8000 Å |
Standard Operating Procedure
Widget text will go here.
Checkout Procedure
The Lab 18-2 is on the LNF Scheduler. LNF constituents may reserve time on the tool, and even request staff support for process development. For more details, LNF researchers can see Lab 18 access and training for the different access types.
- Read through the Standard Operating Procedure above.
- Create a helpdesk ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Maintenance
For more details, see Lab 18-2/Maintenance and qualification.
