Difference between revisions of "Lab 18-2"

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<!-- Set the resource ID, 5 digit # found on the scheduler -->
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[[Sputter_deposition|< Sputter deposition]]
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{{#vardefine:toolid|61081}}
 
<!-- Set the Process Technology (see subcategories on Equipment page) -->
 
<!-- Set the Process Technology (see subcategories on Equipment page) -->
[[Sputter_deposition|< Sputter deposition]]
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{{#vardefine:technology|PVD}}  
{{#vardefine:toolid|61081}} {{#vardefine:technology|PVD}} {{#vardefine:restriction|3}}
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<!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals -->
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{{#vardefine:restriction|3}}
 
{{infobox equipment
 
{{infobox equipment
 
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
 
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
|materials = [[Aluminum|Al]],[[Chromium|Cr]],[[Copper|Cu]],[[Gold|Au]],[[Germanium|Ge]],[[Iridium|Ir]],[[Nickel|Ni]],[[Nickel-Chromium|NiCr]],[[Platinum|Pt]],[[Silicon|Si]],[[Silver|Ag]],[[Titanium|Ti]]
+
|materials = [[Aluminum|Al]], [[Chromium|Cr]], [[Gold|Au]], [[Iridium|Ir]], [[Nickel|Ni]], [[Platinum|Pt]], [[Silver|Ag]], [[Titanium|Ti]], [[Tungsten|W]], [[Tungsten/Titanium|W-Ti]]
 
|mask =  
 
|mask =  
 
|size = 150mm x 4mm and smaller samples
 
|size = 150mm x 4mm and smaller samples
|gases = [[Ar]], [[N2|N<sub>2</sub>]], [[O2|O<sub>2</sub>]]
+
|gases = [[Ar]], [[N2|N<sub>2</sub>]]
 
|overview = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1UZYJ8unAjQOIJ3nJpa1fwXxYKMyW12k6eDR-A-P6fIE/preview System Overview]-->
 
|overview = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1UZYJ8unAjQOIJ3nJpa1fwXxYKMyW12k6eDR-A-P6fIE/preview System Overview]-->
 
|sop = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1EPC0U7RQCQLbFe4fL90aMUlLz-fydskqWrUs4hVPpbM/preview SOP]-->
 
|sop = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1EPC0U7RQCQLbFe4fL90aMUlLz-fydskqWrUs4hVPpbM/preview SOP]-->
|processes = <!--[[STS_Pegasus_4/Processes|Supported Processes]]-->
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|processes = [[Lab 18-2#Supported Processes|Supported Processes]]
|userprocesses = <!--[[LNF_User:STS_Pegasus_4_User_Processes|User Processes]]-->
 
 
}}
 
}}
 +
 
<!-- Insert the tool description here -->
 
<!-- Insert the tool description here -->
Lab 18-2 is a magnetron [[sputter deposition]] tool for depositing conductive metallic films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features.  
+
Lab 18-2 is a [[Sputter_deposition|sputter deposition]] tool used for the application of very thin films; 10-2000nm. This tool is set up to deposit metals including; Au, Ti, Pt, Cr and W among others.
  
 
==Announcements==
 
==Announcements==
 
<!-- *Update this with announcements as necessary -->
 
<!-- *Update this with announcements as necessary -->
The target configuration has been moved to the Supported Process section below. Follow the link to Lab 18-2/Processes. On this page under the Target Calendar header is the link to the calendar.
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*Materials are changed every Monday
 +
 
 +
{{#widget:Iframe
 +
|url=https://docs.google.com/spreadsheets/d/e/2PACX-1vRlmI6w0KI2KXYHH8xyUxhCIDwpUBR0qohNJR61GuVr64OLT9rNYjGCAQ0o9XEGKd2QPwqdJ6uVdsB4/pubhtml?gid=1242670380&amp;single=true&amp;widget=true&amp;headers=false
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|width=900
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|height=500
 +
|border=0
 +
}}
 +
 
 +
[https://docs.google.com/spreadsheets/d/1yMY0SG8PDlF4UWxz96uJVnmP9mcxYr0wGc1xmzmgF48/edit#gid=1242670380| Calendar Link]
 +
*Need a different metal? Request it with Helpdesk!
  
 
==Capabilities==
 
==Capabilities==
 
* Computer controlled recipes  
 
* Computer controlled recipes  
 
* Load lock supported processing  
 
* Load lock supported processing  
* limited film stress versatility with in film development.
+
* Limited film stress versatility with in film development
* Reactive Film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
+
* Reactive Film capabilities (Ar, and N<sub>2</sub>)
  
==System Overview==
+
==Supported Processes==  
The Lab 18-2 has a 18" D-shaped chamber with a load lock chamber to quickly load and unload samples without breaking high vacuum in the process chamber. The tools five magnetron sputtering sources are set up to allow for RF, DC, and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 500C is achieved by using the tools quartz heater lamps.
+
*[[{{BASEPAGENAME}}/Processes]]
  
===Hardware Details===
+
Basic "User" access with the Lab 18's provide researchers with the ability to load, transfer samples, and deposit standard characterized materials. For more details such as standard recipe parameters and sidewall coverage (limited data), see [[{{BASEPAGENAME}}/Processes]].
*Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure
 
*Chamber capacity: single wafer
 
*Configured with load lock
 
*Sample heating – up to 500°C
 
* Power specs
 
**Five 3” Sputtering Guns
 
**2 DC and 2 RF power supply (one for sample bias)
 
  
===Substrate Requirements===
+
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes.  
*Sample sizes: pieces, up to 6” wafers.
 
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
 
** Diameter 150 mm maximum
 
** Substrates up to 4 mm Thick. With special fixture up to 8 mm.
 
 
 
===Material Restrictions===
 
{{material restrictions}}
 
 
 
==Supported Processes==
 
Basic "User" access with the Lab 18's provide researchers the ability to load, transfer samples, and deposit standard characterized materials. For more details, see [[{{BASEPAGENAME}}/Processes]].
 
  
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on [[LNF_User:Lab_18-2_User_Processes|User Processes]]. If you are curious if your material can be deposited in this tool, please contact the tool engineers via the helpdesk ticket system.
+
If you have a material deposition need that is not listed, check to see if this material is deposited on on another PVD tool on the [[LNF PVD Films|LNF PVD Films]] page, or see more options for running your own private material on the [[{{BASEPAGENAME}}/Processes#Target_Calendar|Target configuration]] section of the {{BASEPAGENAME}}/Processes page. The PVD 75 Proline is the preferred sputtering tool for non-standard materials. See how to [http://lnf-wiki.eecs.umich.edu/wiki/LNF_PVD_Films#Requesting_to_Add_New_PVD_Materials Request New PVD Films] here. See more on how to request new sputter sources specifically on the [https://lnf-wiki.eecs.umich.edu/wiki/LNF_Sputter_Adding_New_Films LNF Sputter Adding New Films] page.
  
 
===Process Name===
 
===Process Name===
<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
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<!-- This is an example of a chart published with etch data. You can just replace the url with your own. -->
 
<!-- I would like to make this a table-->
 
<!-- I would like to make this a table-->
  
Fourteen films are available.    If two thicknesses are listed the first is for per run and the second thickness is for total material used per reservation.
+
Multiple staff characterized films are available.    If two thicknesses are listed the first is for per run and the second thickness is for total material used per reservation.
  
 
{| class="wikitable" border="1"
 
{| class="wikitable" border="1"
Line 66: Line 62:
 
|-
 
|-
 
| Aluminum ([[Aluminum|Al]])
 
| Aluminum ([[Aluminum|Al]])
| 1 µm / NA
+
| 5000Å / 1 µm
 
|-
 
|-
| Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])
+
<!--| Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])
 
| 1000Å / NA
 
| 1000Å / NA
|-
+
|-->
| Chrome ([[Chrome|Cr]])
+
| Chromium ([[Chromium|Cr]])
 
| 2000Å / NA
 
| 2000Å / NA
 
|-
 
|-
| Copper ([[Copper|Cu]])
+
<!--| Copper ([[Copper|Cu]])
 
| 1000Å / 5000Å
 
| 1000Å / 5000Å
|-
+
|--->
| Germanium ([[Germanium|Ge]])
+
<!--| Germanium ([[Germanium|Ge]])
 
| 4000 Å / NA
 
| 4000 Å / NA
|-
+
|--->
 
| Gold ([[Gold|Au]])
 
| Gold ([[Gold|Au]])
| 5000Å / NA
+
| 3000Å / 5000Å
 
|-
 
|-
| Iron ([[Iron|Ir]])
+
<!--| Iron ([[Iron|Ir]])
 
| 1000Å / 5000Å  
 
| 1000Å / 5000Å  
|-
+
|--->
 
| Nickel ([[Nickel|Ni]])
 
| Nickel ([[Nickel|Ni]])
| 5000 Å / 1 µm
+
| 2000 Å / 5000Å
 
|-
 
|-
| Molybdenum ([[Molybdenum|Mo]])
+
<!--| Molybdenum ([[Molybdenum|Mo]])
 
| 2000 Å / 8000 Å
 
| 2000 Å / 8000 Å
|-
+
|--->
 
| Platinum ([[Platinum|Pt]])
 
| Platinum ([[Platinum|Pt]])
| 5000 Å / 1 µm
+
| 1000 Å / 5000Å
|-
 
| Silver ([[Silver|Ag]])
 
| 5000 Å / 1 µm
 
 
|-
 
|-
 +
<!--| Silver ([[Silver|Ag]])
 +
| 2000 Å / 5000Å
 +
|--->
 
<!--| Silicon ([[Silicon|Si]])
 
<!--| Silicon ([[Silicon|Si]])
 
| 5000 Å / 1 µm
 
| 5000 Å / 1 µm
Line 104: Line 100:
 
| 5000 Å / 1 µm
 
| 5000 Å / 1 µm
 
|--->
 
|--->
| Tantalum ([[Tantalum|Ta]])
+
<!--| Tantalum ([[Tantalum|Ta]])
 
| 2000 Å / NA
 
| 2000 Å / NA
|-
+
|--->
 
| Titanium ([[Titanium|Ti]])
 
| Titanium ([[Titanium|Ti]])
| 2000 Å / 5000 Å
+
| 3000 Å / 5000 Å
 
|-
 
|-
 
<!--| Titanium Dioxide ([[Titanium Dioxide|TiO<sub>2</sub>]])
 
<!--| Titanium Dioxide ([[Titanium Dioxide|TiO<sub>2</sub>]])
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|-
 
|-
 
| Tungsten/Titanium ([[Tungsten/Titanium|W-Ti]])
 
| Tungsten/Titanium ([[Tungsten/Titanium|W-Ti]])
| 3000 Å / 8000 Å
+
| 3000 Å / 9000 Å
 
|-
 
|-
 
|}
 
|}
  
==Standard Operating Procedure==
+
==System Overview==
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
+
The Lab 18-2 has a 18" D-shaped chamber with a load lock chamber to quickly load and unload samples without breaking high vacuum in the process chamber. The tools five magnetron sputtering sources are set up to allow for RF, DC, and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 500C is achieved by using the tools quartz heater lamps.
{{#widget:GoogleDoc|key=1tXD5ABUT7U9eY8iZhgvfND5XGPfkHmby6O6Tp-9bU1A}}
+
 
 +
===Hardware Details===
 +
*Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure
 +
*Chamber capacity: single wafer
 +
*Configured with a load lock
 +
*Sample heating – up to 500°C
 +
* Power specs
 +
**Five 3” Sputtering Guns
 +
**2 DC and 2 RF power supply (one for sample bias)
 +
 
 +
===Substrate Requirements===
 +
*Sample sizes: pieces, up to 6” wafers.
 +
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
 +
** Diameter 150 mm maximum
 +
** Substrates up to 4 mm Thick. With special fixture up to 8 mm.
 +
** [https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
 +
 
 +
===Material Restrictions===
 +
The Lab 18-2 is the sole sputtering tool for precious metal materials.
 +
{{material restrictions}}
 +
 
 +
== Detailed Operating Procedure ==
 +
{{#widget:GoogleDoc|key=1R_uj2oR6XJHc4D-J8opSyOfX-Xjf9-9ZVN3Jsln4c_o}}
 +
<br>
  
 
==Checkout Procedure==
 
==Checkout Procedure==
The Lab 18-2 is on the [[LNF Scheduler]]. LNF constituents may reserve time on the tool, and even request staff support for process development.
+
For more details, see [[KJLC Sputter Tool Access and Training]].
<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
+
# Complete the online [https://rise.articulate.com/share/Ao7oMeRC8efjEeqElzqlBiPE6uyJ9y-T#/ PVD Rise Training] (this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)
For more details, see [[Lab 18 access and training]].
+
# Read through this Wiki page and the Operating Procedure above.
# Read through the Standard Operating Procedure above.
+
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training
<!--# Complete the training request form [<link> here]. -->
+
# A tool engineer or user services member will contact you for a training session.
# Create a helpdesk ticket requesting training.
 
# A tool engineer will schedule a time for initial training.
 
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
<!--# Complete the SOP quiz [<link> here]. -->
+
# Complete the [https://docs.google.com/forms/d/e/1FAIpQLSevGEsCoP5aNyADbDpt3_7tflfn_1mZNA-EM2lOOA0doqYbyw/viewform?embedded=true#start=embed| Lab 18 User Training Quiz]
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
+
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool at the "user" level.
 +
 
 +
==Maintenance==
 +
The sputter shield cleaning procedure is provided below. The source shields are stored on the rack between the Lab 18s when they are not installed. Some films that build up on the shield risk flaking off and shorting out plasma (W-Ti and ITO are the most frequent offenders).  This procedure mitigates that, so it is posted here to empower users.
  
<!--==Tool Qualification== -->
+
[https://docs.google.com/document/d/1TZFJKKvrBdjAQzsVgegt7mPrAVCy0OPCNOY276lf9vc/edit?usp=sharing| Lab 18 Shield Cleaning Procedure]
<!-- Describe standard maintenance/qualification tests here -->
 
  
==Maintenance==
 
 
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].
 
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].

Latest revision as of 09:23, 24 June 2022

< Sputter deposition


Lab 18-2
61081.jpg
Equipment Details
Technology PVD
Materials Restriction Metals
Material Processed Al, Cr, Au, Ir, Ni, Pt, Ag, Ti, W, W-Ti
Sample Size 150mm x 4mm and smaller samples
Gases Used Ar, N2
Equipment Manual
Supported Processes Supported Processes


Lab 18-2 is a sputter deposition tool used for the application of very thin films; 10-2000nm. This tool is set up to deposit metals including; Au, Ti, Pt, Cr and W among others.

Announcements

  • Materials are changed every Monday

Calendar Link

  • Need a different metal? Request it with Helpdesk!

Capabilities

  • Computer controlled recipes
  • Load lock supported processing
  • Limited film stress versatility with in film development
  • Reactive Film capabilities (Ar, and N2)

Supported Processes

Basic "User" access with the Lab 18's provide researchers with the ability to load, transfer samples, and deposit standard characterized materials. For more details such as standard recipe parameters and sidewall coverage (limited data), see Lab 18-2/Processes.

In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes.

If you have a material deposition need that is not listed, check to see if this material is deposited on on another PVD tool on the LNF PVD Films page, or see more options for running your own private material on the Target configuration section of the Lab 18-2/Processes page. The PVD 75 Proline is the preferred sputtering tool for non-standard materials. See how to Request New PVD Films here. See more on how to request new sputter sources specifically on the LNF Sputter Adding New Films page.

Process Name

Multiple staff characterized films are available. If two thicknesses are listed the first is for per run and the second thickness is for total material used per reservation.

Material Max thickness (Run/Reservation)
Aluminum (Al) 5000Å / 1 µm
Chromium (Cr) 2000Å / NA
Gold (Au) 3000Å / 5000Å
Nickel (Ni) 2000 Å / 5000Å
Platinum (Pt) 1000 Å / 5000Å
Titanium (Ti) 3000 Å / 5000 Å
Tungsten (W) 3000 Å / 9000 Å
Tungsten/Titanium (W-Ti) 3000 Å / 9000 Å

System Overview

The Lab 18-2 has a 18" D-shaped chamber with a load lock chamber to quickly load and unload samples without breaking high vacuum in the process chamber. The tools five magnetron sputtering sources are set up to allow for RF, DC, and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 500C is achieved by using the tools quartz heater lamps.

Hardware Details

  • Cryo pumped chamber – upper 10-7 Torr base pressure
  • Chamber capacity: single wafer
  • Configured with a load lock
  • Sample heating – up to 500°C
  • Power specs
    • Five 3” Sputtering Guns
    • 2 DC and 2 RF power supply (one for sample bias)

Substrate Requirements

  • Sample sizes: pieces, up to 6” wafers.
  • Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
    • Diameter 150 mm maximum
    • Substrates up to 4 mm Thick. With special fixture up to 8 mm.
    • Sample Mounting

Material Restrictions

The Lab 18-2 is the sole sputtering tool for precious metal materials. The Lab 18-2 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Detailed Operating Procedure

Widget text will go here.

Checkout Procedure

For more details, see KJLC Sputter Tool Access and Training.

  1. Complete the online PVD Rise Training (this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)
  2. Read through this Wiki page and the Operating Procedure above.
  3. Create a Helpdesk Ticket requesting training
  4. A tool engineer or user services member will contact you for a training session.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the Lab 18 User Training Quiz
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool at the "user" level.

Maintenance

The sputter shield cleaning procedure is provided below. The source shields are stored on the rack between the Lab 18s when they are not installed. Some films that build up on the shield risk flaking off and shorting out plasma (W-Ti and ITO are the most frequent offenders). This procedure mitigates that, so it is posted here to empower users.

Lab 18 Shield Cleaning Procedure

For more details, see Lab 18-2/Maintenance and qualification.