Lab 18-2

Lab 18-2
Equipment Details
Technology	PVD
Materials Restriction	Undefined
Material Processed	Si
Mask Materials	PR, SiO2
Sample Size	150mm x 4mm and smaller samples
Gases Used	Ar, N2, O2
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
User Processes	User Processes

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This page has not been released yet.

Lab 18-2 is a magnetron sputter deposition tool for depositing conductive metallic films.

Announcements

• Update this with announcements as necessary

System Overview

Tool Capabilities/Limitations

• Hardware Details
  • Power specs
  • Chemicals
  • Gases

• Capabilities
  • Resolution
  • Aspect Ratio
  • Thickness range

Substrate Requirements

• Sample size range
  • Diameter
  • Thickness

Material Restrictions

• materials allowed
• materials not allowed

Supported Processes

There are several recipes supported by the LNF, including an oxide etch, nitride etch, and polysilicon etch. For more details, see Lab 18-2/Processes.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [LAM 9400 User Processes]. If you are curious if your material can be etched in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

Document Link

Checkout Procedure

1. Read through the Standard Operating Procedure above.
2. Complete the training request form [<link> here].
3. Create a helpdesk ticket requesting training.
4. A tool engineer will schedule a time for initial training.
5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
6. Complete the SOP quiz [<link> here].
7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.