Difference between revisions of "Lab 18-2"
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| + | ==Access and Training== | ||
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| + | For more details, see [[{{BASEPAGENAME}}/Access & Training]]. | ||
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| + | ==Tool Qualifications== | ||
| + | For more details, see [[{{BASEPAGENAME}}/Maintenance & Qualification]]. | ||
Revision as of 16:09, 21 April 2015
| Lab 18-2 | |
|---|---|
 | |
| Equipment Details | |
| Technology | PVD |
| Materials Restriction | Metals |
| Material Processed | Si |
| Mask Materials | PR, SiO2 |
| Sample Size | 150mm x 4mm and smaller samples |
| Gases Used | Ar, N2, O2 |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| User Processes | User Processes |
 Warning: | This page has not been released yet. |
Lab 18-2 is a magnetron sputter deposition tool for depositing conductive metallic films.
Contents
Announcements
- Update this with announcements as necessary
System Overview
Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms.
Tool Capabilities/Limitations
- Hardware Details
- Sample sizes: pieces, up to 6” wafers.
- Cryo pumped chamber – upper 10-7 base pressure
- Chamber capacity: single wafer
- Configured with load lock
- Sample heating – up to 500°C
- Power specs
- Five 3” Sputtering Guns
- 2 DC and 2 RF power supply (one for sample bias)
- Gases
- Sputtering gases available: Ar, O2, and N2
- Capabilities
- Resolution
- Thickness range
Substrate Requirements
- Sample sizes: pieces, up to 6” wafers.
- Wafer holders available For 2", 3", 4", 6"; was well as clip fixtures for smaller pieces
- Diameter 150mm maximum
- Substrates up to 4mm Thick. With special fixture up to 8mm.
Material Restrictions
The Lab 18-2 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported Processes
Basic "User" access with the Lab 18's provide researchers the ability to load, transfer samples, ans deposit standard characterized materials.. For more details, see Lab 18-2/Processes.
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on [Lab 18-2 User Processes]. If you are curious if your material can be deposited in this tool, please contact the tool engineers via the helpdesk ticket system.
Process Name
Access and Training
For more details, see Lab 18-2/Access & Training.
Tool Qualifications
For more details, see Lab 18-2/Maintenance & Qualification.
