Lab 18-2
Lab 18-2 | |
---|---|
Equipment Details | |
Technology | PVD |
Materials Restriction | Undefined |
Material Processed | Si |
Mask Materials | PR, SiO2 |
Sample Size | 150mm x 4mm and smaller samples |
Gases Used | Ar, N2, O2 |
Equipment Manual | |
Overview | System Overview |
Operating Procedure | SOP |
Supported Processes | Supported Processes |
User Processes | User Processes |
This page has not been released yet. |
Lab 18-2 is a magnetron sputter deposition tool for depositing conductive metallic films.
Contents
Announcements
- Update this with announcements as necessary
System Overview
Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms.
Tool Capabilities/Limitations
- Hardware Details
- Sample sizes: pieces, up to 6” wafers.
- Cryo pumped chamber – upper 10-7 base in 1 hour
- Chamber capacity: single wafer
- Configured with load lock
- Sample heating – up to 500°C
- Power specs
- Five 3” Sputtering Guns
- 2 DC and 2 RF power supply (one for sample bias)
- Gases
- Sputtering gases available: Ar, O2, and N2
- Capabilities
- Resolution
- Thickness range
Substrate Requirements
- Sample sizes: pieces, up to 6” wafers.
- Diameter
- Substrates to 4mm Thick. With special fixture up to 8mm.
Material Restrictions
- materials allowed
- materials not allowed
Supported Processes
There are several recipes supported by the LNF, including an oxide etch, nitride etch, and polysilicon etch. For more details, see Lab 18-2/Processes.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [LAM 9400 User Processes]. If you are curious if your material can be etched in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard Operating Procedure
Checkout Procedure
- Read through the Standard Operating Procedure above.
- Complete the training request form [<link> here].
- Create a helpdesk ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Complete the SOP quiz [<link> here].
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Tool Qualification
Process Name