Lab 18-2

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Lab 18-2
Equipment Details
Technology PVD
Materials Restriction Metals
Material Processed Si
Mask Materials PR, SiO2
Sample Size 150mm x 4mm and smaller samples
Gases Used Ar, N2, O2
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes

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Lab 18-2 is a magnetron sputter deposition tool for depositing conductive metallic films.


  • Update this with announcements as necessary

System Overview

Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms.

Tool Capabilities/Limitations

  • Hardware Details
    • Sample sizes: pieces, up to 6” wafers.
    • Cryo pumped chamber – upper 10-7 base pressure
    • Chamber capacity: single wafer
    • Configured with load lock
    • Sample heating – up to 500°C
    • Power specs
      • Five 3” Sputtering Guns
      • 2 DC and 2 RF power supply (one for sample bias)
    • Gases
    • Sputtering gases available: Ar, O2, and N2
  • Capabilities
    • Resolution
    • Thickness range

Substrate Requirements

  • Sample sizes: pieces, up to 6” wafers.
  • Wafer holders available For 2", 3", 4", 6"; was well as clip fixtures for smaller pieces
    • Diameter 150mm maximum
    • Substrates up to 4mm Thick. With special fixture up to 8mm.

Material Restrictions

The Lab 18-2 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email for any material requests or questions.

Supported Processes

Basic "User" access with the Lab 18's provide researchers the ability to load, transfer samples, ans deposit standard characterized materials.. For more details, see Lab 18-2/Processes.

In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on [Lab 18-2 User Processes]. If you are curious if your material can be deposited in this tool, please contact the tool engineers via the helpdesk ticket system.

Process Name

Access and Training

For more details, see Lab 18-2/Access & Training.

Tool Qualifications

For more details, see Lab 18-2/Maintenance & Qualification.