|Al, Cr, Au, Ir, Ni, Pt, Ag, Ti, W, W-Ti
|150mm x 4mm and smaller samples
Lab 18-2 is a sputter deposition tool used for the application of very thin films; 10-2000nm. This tool is set up to deposit metals including; Au, Ti, Pt, Cr and W among others.
- Materials are changed every Monday
- Need a different metal? Request! https://lnf-help.eecs.umich.edu/scp/login.php
- Computer controlled recipes
- Load lock supported processing
- Limited film stress versatility with in film development
- Reactive Film capabilities (Ar, and N2)
Basic "User" access with the Lab 18's provide researchers with the ability to load, transfer samples, and deposit standard characterized materials. For more details such as standard recipe parameters and sidewall coverage (limited data), see Lab 18-2/Processes.
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes.
If you have a material deposition need that is not listed, check to see if this material is deposited on on another PVD tool on the LNF PVD Films page, or see more options for running your own private material on the Target configuration section of the Lab 18-2/Processes page. The PVD 75 Proline is the preferred sputtering tool for non-standard materials. See how to Request New PVD Films here. See more on how to request new sputter sources specifically on the LNF Sputter Adding New Films page.
Multiple staff characterized films are available. If two thicknesses are listed the first is for per run and the second thickness is for total material used per reservation.
|Max thickness (Run/Reservation)
|5000Å / 1 µm
|2000Å / NA
|3000Å / 5000Å
|2000 Å / 5000Å
|1000 Å / 5000Å
|3000 Å / 5000 Å
|3000 Å / 9000 Å
|3000 Å / 9000 Å
The Lab 18-2 has a 18" D-shaped chamber with a load lock chamber to quickly load and unload samples without breaking high vacuum in the process chamber. The tools five magnetron sputtering sources are set up to allow for RF, DC, and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 500C is achieved by using the tools quartz heater lamps.
- Cryo pumped chamber – upper 10-7 Torr base pressure
- Chamber capacity: single wafer
- Configured with a load lock
- Sample heating – up to 500°C
- Power specs
- Five 3” Sputtering Guns
- 2 DC and 2 RF power supply (one for sample bias)
- Sample sizes: pieces, up to 6” wafers.
- Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
- Diameter 150 mm maximum
- Substrates up to 4 mm Thick. With special fixture up to 8 mm.
- Sample Mounting
The Lab 18-2 is the sole sputtering tool for precious metal materials. The Lab 18-2 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email firstname.lastname@example.org for any material requests or questions.
Detailed Operating Procedure
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For more details, see KJLC Sputter Tool Access and Training.
- Complete the online PVD Rise Training (this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)
- Read through this Wiki page and the Operating Procedure above.
- Create a Helpdesk Ticket requesting training
- A tool engineer or user services member will contact you for a training session.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Complete the Lab 18 User Training Quiz
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool at the "user" level.
The sputter shield cleaning procedure is provided below. The source shields are stored on the rack between the Lab 18s when they are not installed. Some films that build up on the shield risk flaking off and shorting out plasma (W-Ti and ITO are the most frequent offenders). This procedure mitigates that, so it is posted here to empower users.
For more details, see Lab 18-2/Maintenance and qualification.